Ceramic Electronic Component Metal Terminal Vibration Suppression
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Solution Overview
Problem
Conventional ceramic electronic components with metal terminals tend to transfer vibration from the chip component to the mounting base board, leading to squealing noise and requiring high-temperature soldering, which poses environmental and reliability concerns.
Innovation Solution
The ceramic electronic component features metal terminals with a connecting part, joint parts, and mounting parts that wrap around the chip component's side faces, providing a predetermined space to absorb and disperse vibration, reducing the transmission of noise and eliminating the need for high-temperature soldering by using nonconductive adhesive agents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the metal terminal part directly connects the chip component to the mounting base board, then the electrical connection is reliable, but the vibration from the chip component transfers to the mounting base board causing squealing noise
Solution Approach 1:
The joint part serves as an intermediary element between the connecting part (attached to chip component) and the mounting part (attached to mounting base board). This intermediate structure interrupts the direct vibration transmission path while maintaining electrical connectivity, thereby eliminating squealing noise without compromising connection reliability.
Solution Approach 2:
The metal terminal part is configured to extend in multiple directions: the connecting part extends in a first direction from the chip component, the joint part extends in a second direction (different from the first), and the mounting part extends in a third direction (different from both first and second directions). This multi-dimensional arrangement creates a longer, more complex vibration transmission path that suppresses noise while maintaining reliable electrical connection.
2Object-generated harmful factors
If the metal terminal part uses a long transmission route for vibration isolation, then squealing noise is reduced, but the ESL (Equivalent Series Inductance) increases
Solution Approach 1:
By configuring the metal terminal part to extend in multiple directions (first direction from chip component, second direction for joint part, third direction for mounting part), the patent creates a compact three-dimensional structure. This multi-dimensional arrangement achieves a longer vibration transmission path for noise suppression while keeping the overall spatial footprint small, thereby maintaining low ESL characteristics.
3Volume of moving object
If the mounting part is positioned close to the chip component for compact design, then the component size is reduced, but the vibration transmission path becomes too short to suppress squealing noise
Solution Approach 1:
The patent utilizes three-dimensional space by configuring the metal terminal part to extend in multiple directions rather than a single linear path. The connecting part, joint part, and mounting part extend in first, second, and third directions respectively, creating a compact yet sufficiently long vibration transmission path that suppresses squealing noise while maintaining a small overall component volume.
4Ease of manufacture
If the conventional bending structure is used for the metal terminal, then the manufacturing is simple, but the vibration easily transfers to the mounting base board
Solution Approach 1:
The metal terminal part is segmented into three distinct functional parts: the connecting part (attached to chip component), the joint part (intermediate connection), and the mounting part (attached to mounting base board). This segmentation interrupts the vibration transmission path while maintaining manufacturing feasibility through a modular structure that can be formed using conventional processes.
Solution Approach 2:
The joint part acts as an intermediary element that connects the connecting part and the mounting part. This intermediate structure breaks the direct vibration transmission path from the chip component to the mounting base board, suppressing squealing noise while maintaining a manufacturable structure through a clear division of functional segments.
Data Source
AI summary
A ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with the terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.