Ceramic Through-Substrate Interconnects for High-Frequency PCB Assembly
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Solution Overview
Problem
High-frequency signal transmission in electronic components connected to printed circuit boards (PCBs) via ceramic substrates faces challenges due to significant inductance and radiation from wire bonds, causing crosstalk and attenuation.
Innovation Solution
The use of a ceramic substrate with conductive structures passing through its layers, connected to a ball grid array of solder balls, allows electronic components to be directly connected to PCBs, minimizing signal interference by eliminating the need for external wire bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds are used to connect electronic components to PCBs via ceramic substrates, then electrical connection is achieved, but significant inductance and radiation cause crosstalk and signal attenuation at high frequencies
Solution Approach 1:
The patent extracts and eliminates the wire bonds from the connection path between electronic components and PCBs. By using conductive structures that pass directly through the ceramic substrate layers, the harmful wire bonds are removed, thereby eliminating their inductance and radiation effects that caused signal degradation at high frequencies
Solution Approach 2:
The patent transitions from a surface-level connection approach (wire bonds extending externally on the ceramic substrate surface) to a through-substrate connection approach (conductive structures passing vertically through the ceramic layers). This dimensional change from surface to through-substrate routing reduces the connection path length and eliminates the harmful electromagnetic effects of external wire bonds
2Object-affected harmful factors
If conductive structures pass through ceramic substrate layers, then wire bonds are eliminated reducing inductance and radiation, but manufacturing complexity increases
Solution Approach 1:
The conductive structures are incorporated into the ceramic substrate during its manufacturing process, before the substrate is assembled into the final electronic component. This preliminary integration of conductive elements into the ceramic layers simplifies the overall manufacturing by combining multiple steps (substrate fabrication and conductive structure creation) into a single integrated process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures high-frequency signal integrity and reduces crosstalk and attenuation, improving the electrical connection between electronic components and PCBs.
Implementation Method 1
a plurality of conductive structures passing through the substrate between the top surface and the bottom surface of the substrate
Implementation Method 2
a ball grid array disposed on the bottom surface of the substrate, the ball grid array comprising a plurality of solder balls, wherein at least a portion of the solder balls are connected to at least a portion of the conductive structures
Data Source
AI summary
An electronic sub-assembly, which may include: a ceramic substrate having a top surface and a bottom surface, a plurality of layers of ceramic material disposed between the top surface and the bottom surface of the substrate, and a plurality of conductive structures passing through the substrate between the top surface and the bottom surface of the substrate; and a ball grid array disposed on the bottom surface of the substrate, the ball grid array comprising a plurality of solder balls, wherein at least a portion of the solder balls are connected to at least a portion of the conductive structures.