Ceramic UV-C LED Bracket With Electroplated Frame Connection
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Solution Overview
Problem
Deep ultraviolet light emitting diodes (UV-C LEDs) have a short service life due to thermal mismatch between ceramic substrates and metal dams, poor heat resistance of packaging glue, and high processing costs associated with existing connection methods like brazing and diffusion welding.
Innovation Solution
A bracket structure composed of double layers of ceramic with electroplating connection, which matches thermal expansion coefficients and avoids high-temperature processing, using electroplating to connect ceramic frames with metal cladding layers and a spacer for enhanced stability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If brazing or diffusion welding is used to connect the optical lens and bracket structure, then the connection strength is improved, but the processing cost increases and thermal damage may occur
Solution Approach 1:
The patent replaces thermal connection methods (brazing, diffusion welding) with electroplating technology. The electroplating process deposits a metal layer on the ceramic bracket surface, creating a strong metallurgical bond without requiring high temperatures. This substitution eliminates the need for expensive thermal processing equipment and reduces manufacturing costs while maintaining connection strength.
Solution Approach 2:
The patent changes the connection mechanism from thermal-based (brazing/welding) to electrochemical-based (electroplating). By altering the fundamental parameter of connection methodology, the process avoids high-temperature thermal damage to the UV-C LED chip and packaging materials while achieving adequate bond strength through electroplated metal interlayers.
2Ease of manufacture
If packaging glue is used to bond the optical lens and dam, then the manufacturing process is simplified, but the heat resistance and service life are reduced
Solution Approach 1:
The patent replaces adhesive bonding (chemical bonding via packaging glue) with electroplating (metallurgical bonding). The electroplated metal layer provides a thermally stable, permanent bond that can withstand the high temperatures and thermal cycling conditions, eliminating the heat resistance limitations of organic packaging glues while extending device service life.
3Reliability
If ceramic substrates with metal cladding layers are connected using traditional methods, then the thermal expansion mismatch causes stress and reduces reliability, but switching to electroplating requires additional process steps
Solution Approach 1:
The patent uses the electroplated metal layer as an intermediary between the ceramic substrates. This intermediate layer has thermal expansion properties that bridge the gap between ceramics, reducing thermal stress. The electroplating process integrates the formation of this intermediary layer into a single step that simultaneously provides both bonding and thermal stress management functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic bracket structure significantly extends the operational life of UV-C LEDs by withstanding high temperatures and thermal shocks, reducing manufacturing costs, and improving reliability under varying temperature conditions.
Implementation Method 1
The electroplating layer is located between the first frame and the second frame that are placed opposite to each other, and connected to the first metal cladding layer and the second metal cladding layer by electroplating, respectively.
Data Source
AI summary
An electronic device, a semiconductor device, a packaging structure, a bracket and a method for manufacturing the bracket, belonging to the field of semiconductor device packaging. The bracket includes a first frame and a second frame placed opposite to each other and connected through an electroplating layer. In the above, the first frame and the second frame are both ceramic-based and formed with a metal layer on a surface. The bracket has a longer service life.