Ceramic Vapor Chamber Frame Layout to Prevent Cracks
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Solution Overview
Problem
Existing thermal devices using ceramic vapor chambers face challenges in durability due to reduced thickness and stress from communication paths for actuating fluid, leading to potential cracks and reduced heat dissipation efficiency.
Innovation Solution
The thermal device incorporates communication paths in a frame region surrounding the actuating region, using ceramic materials to enhance durability and reliability, with a configuration that minimizes stress and expands the effective internal space for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If communication paths are formed in the actuating region of the ceramic vapor chamber, then the actuating fluid can be injected and the vapor chamber can function, but the thickness of the ceramic plate is reduced and stress concentrates leading to potential cracks
Solution Approach 1:
The ceramic plate is divided into two distinct regions: the actuating region for sealing the actuating fluid and the frame region surrounding it. The communication paths are specifically located in the frame region rather than the actuating region, segmenting the functional areas to avoid stress concentration in the critical actuating region while still enabling fluid injection through the frame region.
Solution Approach 2:
The frame region acts as an intermediary structure that mediates between the need for communication paths (for fluid injection) and the need to maintain ceramic plate strength. By providing communication paths in the frame region, the intermediary structure allows fluid access without compromising the integrity of the actuating region.
2Ease of operation
If communication paths are formed in the actuating region, then fluid injection is enabled, but the effective internal space for heat transfer is reduced
Solution Approach 1:
The ceramic plate is segmented into the actuating region (for fluid sealing) and the frame region (for communication paths). This segmentation ensures that communication paths are formed only in the frame region, preserving the maximum internal space within the actuating region for efficient heat transfer while still enabling fluid injection through the frame region.
3Ease of operation
If the ceramic plate thickness is reduced to accommodate communication paths, then fluid injection is possible, but stress increases and cracks may form
Solution Approach 1:
The ceramic plate is segmented into the actuating region and the frame region, with communication paths located exclusively in the frame region. This segmentation allows the actuating region to maintain its full thickness and structural integrity, avoiding stress concentration and crack formation, while the frame region provides accessible communication paths for fluid injection.
4Ease of operation
If communication paths are located in the actuating region, then fluid injection is enabled, but heat dissipation efficiency is reduced due to stress and potential cracks
Solution Approach 1:
The ceramic plate is segmented into the actuating region (for fluid sealing and heat transfer) and the frame region (for communication paths). This segmentation ensures that communication paths do not compromise the heat dissipation efficiency of the actuating region by avoiding stress concentration and crack formation in that critical area, while still enabling fluid injection through the frame region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances durability and heat dissipation characteristics by reducing stress on the ceramic container, preventing cracks and maintaining efficient thermal diffusion across a wide temperature range.
Implementation Method 1
a thermal device that utilizes latent heat of a phase transformation substance
Implementation Method 2
utilizes latent heat associated with evaporation and condensation of an actuating fluid
Implementation Method 3
releases heat from a heat-generating component by transporting heat from a high-temperature portion to a low-temperature portion
Data Source
AI summary
A thermal device according to the present disclosure is a thermal device that utilizes latent heat of a phase transformation substance. The thermal device according to the present disclosure includes a ceramic container and a sealing portion. The ceramic container includes a phase transformation region in which the phase transformation substance is sealed, a frame region surrounding the phase transformation region, and a communication path configured to connect the phase transformation region with the outside. The sealing portion blocks the communication paths. The communication path is located in the frame region.