Via Formation in Ceramic Carrier Layers via Active Soldering
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Solution Overview
Problem
Existing methods for producing plated-through holes in ceramic carrier layers are complex and lack control, requiring additional steps and not efficiently addressing parasitic induction effects and thermomechanical stresses.
Innovation Solution
A method involving the use of an active soldering or DCB process to form plated-through holes by filling ceramic carrier layer through-holes with a paste, where the soldering temperatures create the plated-through hole, and adjusting parameters like degree of filling and process pressure to set specific electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If additional work steps are used to form plated-through holes separately, then manufacturing precision can be improved, but device complexity and production time increase
Solution Approach 1:
The patent combines the formation of plated-through holes with the active soldering process by applying paste containing solder material and active component into the through-holes before the soldering step. The active soldering simultaneously creates both the mechanical connection and the plated-through hole structure, eliminating the need for separate plating operations and reducing overall process complexity while maintaining precision.
Solution Approach 2:
The paste is applied to the through-holes in advance of the active soldering process. This preliminary application ensures that the solder material is already positioned correctly in the through-holes before the soldering takes place, allowing the plated-through holes to form automatically during the soldering step without requiring additional separate operations.
2Manufacturing precision
If through-holes are filled completely with paste, then electrical resistance control is improved, but manufacturing complexity increases
Solution Approach 1:
The patent controls electrical resistance by adjusting parameters of the paste application process, such as the amount of paste applied, the degree of filling (partially or completely), and the composition of the paste. By varying these parameters, specific electrical resistance values can be achieved without requiring complex additional manufacturing steps, as the resistance control is integrated into the paste application and soldering process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production of plated-through holes, reduces additional work steps, and allows for controlled electrical resistance adjustment, enhancing the compact arrangement of components and reducing parasitic induction and thermomechanical stresses.
Implementation Method 1
the temperatures used when carrying out the active soldering method can also be used to form the plated-through hole
Implementation Method 2
carrying out a connection method for connecting a metallization to the carrier layer by means of an active soldering method
Implementation Method 3
If the metallization is connected by means of a DCB process
Data Source
Figure 1a~1c
Figure 1d
Figure 2
AI summary
The invention relates to a method for producing a via in a carrier layer (1) produced from a ceramic, comprising: providing the carrier layer (1), creating a through-hole (2) in the carrier layer, at least partially filling the through-hole with a paste, and carrying out a connecting method for connecting a metallization to the carrier layer, in particular an active solder method or a DCB method, the via being created from the paste in the through-hole when the connecting method is carried out.