Ceramic Wafer Heater Terminal Structure for Efficient Heat Transfer
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Solution Overview
Problem
Existing ceramic structures used in semiconductor manufacturing apparatuses face challenges in efficiently transferring heat from internal resistance heating elements to the wafer surface due to the design of terminal parts, which can lead to poor conduction and reliability issues.
Innovation Solution
The ceramic structure incorporates a base body with a reduced-diameter portion in the terminal part holes, ensuring secure connection and efficient heat transfer by positioning the connection conductors closer to the wafer surface, and using sealing members to enhance oxidation resistance and thermal insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the terminal part is positioned at the lower surface of the base body with a flat design, then the manufacturing process is simplified, but the heat transfer efficiency from the internal conductor to the wafer deteriorates
Solution Approach 1:
The connection conductor is positioned not only at the lower surface but also extends upward into the base body, utilizing the vertical dimension to reduce distance to the internal conductor. This spatial repositioning improves thermal coupling while the lower surface connection maintains manufacturing simplicity.
2Ease of operation
If the terminal part is exposed from the lower surface of the base body, then electrical connection is facilitated, but the reliability of the connection deteriorates due to detachment risk
Solution Approach 1:
The terminal part is nested within a recess of the base body rather than being fully exposed. This recess structure provides mechanical support and prevents detachment while maintaining electrical connectivity. The terminal part is embedded in the base body like a nested doll, securing it in place.
3Productivity
If the connection conductor is positioned closer to the upper surface of the base body, then the heat transfer path is shortened and heating efficiency is improved, but the structural support for the terminal part deteriorates
Solution Approach 1:
The base body is segmented into different functional regions: a lower recess portion that provides structural support for the terminal part, and an upper region that allows the connection conductor to extend close to the internal conductor for efficient heat transfer. This segmentation enables both structural integrity and thermal efficiency.
4Reliability
If the hole diameter is reduced to secure the connection conductor, then the detachment probability is reduced, but the manufacturing precision requirement increases
Solution Approach 1:
The hole in the base body has varying diameter along its length: a narrower upper portion that secures the connection conductor and prevents detachment, and a wider lower portion that is easier to manufacture. This local variation in hole quality provides both security and manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the reliability of electrical connections, reduces the probability of terminal parts detaching, and enhances heating efficiency by ensuring effective heat transfer from the resistance heating element to the wafer surface.
Implementation Method 1
ensuring efficient heat transfer by positioning the connection conductors closer to the wafer surface
Implementation Method 2
internal resistance heating elements
Data Source
AI summary
A heater includes a base body, resistance heating element, and terminal part. The base body comprises ceramic, is plate shaped, and includes a hole on its lower surface. The resistance heating element is inside the base body. The terminal part is electrically connected to an internal conductor, is at least partially located inside the base body, and is exposed from a lower surface of the base body to an exterior of the base body. The terminal part includes a connection conductor that is inserted in the hole and connected to the internal conductor. A lower surface of the connection conductor is located on a side closer to the upper surface of the base body. The hole includes a reduced-diameter portion which has a diameter smaller than a diameter of the connection conductor between the lower surface of the connection conductor and the lower surface of the base body.