Ceramic Wafer Support Surface for Low-Particle Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor manufacturing equipment members face issues with ceramic particles falling off due to wafer sliding, leading to particle generation and reduced yield.
Innovation Solution
The member for semiconductor manufacturing equipment features a ceramic substrate with upper end surfaces having patterned concave-convex shapes, such as streak-like, dot-like, dimple, or net-like patterns, reducing contact area and friction to minimize particle fallout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the upper end surfaces of protrusions have a smooth flat shape, then the wafer can be stably supported, but ceramic particles fall off due to wafer sliding causing particle generation
Solution Approach 1:
The invention applies different surface characteristics to different regions of the protrusions. The upper end surfaces are provided with concave-convex patterns (local roughness) to reduce particle detachment during wafer sliding, while maintaining overall structural integrity and support function. This local modification of surface quality resolves the contradiction between stable support and particle generation.
Solution Approach 2:
The concave-convex patterned surfaces introduce curved geometric features rather than flat surfaces. These curved patterns reduce the contact area between the wafer and protrusions, thereby reducing friction and preventing ceramic particle detachment during wafer sliding, while still providing adequate support.
2Reliability
If the contact area between wafer and protrusions is increased, then support stability is improved, but friction increases causing more particle detachment
Solution Approach 1:
The invention creates a surface with localized concave and convex regions that optimize the contact characteristics. The patterned surface provides sufficient contact points for stable support while limiting continuous contact areas that would generate excessive friction and particle detachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses particle generation, enhancing semiconductor quality and yield stability by minimizing ceramic particle detachment during wafer sliding.
Implementation Method 1
they have the function of applying electrical power for electrostatic adsorption to an internal electrode and adsorbing a wafer using electrostatic force
Implementation Method 2
Some members are known that have a function of controlling the temperature of the wafer by flowing gas between the wafer placement surface and the wafer
Data Source
AI summary
A member for a semiconductor manufacturing equipment includes a ceramic substrate, wherein the ceramic substrate includes an upper surface having a plurality of protrusions for placing a wafer, wherein each of the plurality of protrusions has an upper end surface, and at least one of the upper end surfaces has a patterned concave-convex shape.