Ceramic Wafer Placement Table With Seamless RF Electrode Connection
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Solution Overview
Problem
The use of a coil as a connector in a wafer placement table leads to deformation and varying contact resistance between the sub-RF electrode and jumper, making stable electrical connections challenging.
Innovation Solution
A seamless one-piece structure is formed by integrating the first and second conductive layers and the connector within a ceramic plate, ensuring stable electrical connections by preventing disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coil is used as the connector to connect the sub-RF electrode and jumper, then the electrical connection can be established, but the contact resistance varies and the connection stability deteriorates due to deformation
Solution Approach 1:
The patent merges the connector with the sub-RF electrode and jumper into a single integrated conductive component. This eliminates the separate coil connector that caused deformation and variable contact resistance, creating a unified structure where the conductor seamlessly connects all elements without mechanical interfaces that could deform or lose contact stability.
2Reliability
If a coil connector is used to connect conductive layers at different heights, then electrical connection is achieved, but the contact resistance varies with position
Solution Approach 1:
The connector is merged into the conductive layers to form a single integrated structure. This eliminates the separate coil that made contact at different heights with varying resistance, creating a unified conductor that maintains consistent electrical properties throughout the connection path regardless of positional variations.
3Ease of manufacture
If separate components are used for sub-RF electrode, connector, and jumper, then assembly flexibility is maintained, but disconnection and contact instability occur
Solution Approach 1:
The sub-RF electrode, connector, and jumper are merged into a single integrated conductive component. This eliminates the separate parts that could disconnect or become unstable, creating a unified structure where all elements are permanently bonded together, ensuring reliable electrical connection without assembly/disassembly issues.
Data Source
AI summary
A wafer placement table includes: a first conductive layer; a second conductive layer different in height from the first conductive layer; and a connector that electrically connect the first conductive layer and the second conductive layer, inside a ceramic plate having a wafer placement surface on its upper surface. The first conductive layer, the second conductive layer and the connector are formed in a seamless one-piece structure.