Ceramic Carrier Wavelength Conversion Modules for High-Temp Stability
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Solution Overview
Problem
Conventional wavelength conversion devices using metal substrates are unsuitable for high-power applications due to thermal conductivity issues, deformation, and adherence problems with phosphor layers, which lead to instability and reduced performance.
Innovation Solution
A wavelength conversion device utilizing ceramic carriers with high thermal conductivity, divided into multiple modules, supported by a metal or composite base plate, with a reflective layer and phosphor layers coated on each carrier, allowing for improved thermal management and flexibility in processing and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If glass powder is used as adhesive to replace silica gel for high temperature applications, then thermal resistance is improved, but sintering temperature above 500°C causes metal substrate softening, deformation, and oxidization
Solution Approach 1:
The patent uses ceramic materials as substrates instead of metal substrates. Ceramic materials can withstand high sintering temperatures (above 500°C) without softening, deformation, or oxidization, while providing good adhesion for phosphor layers. This composite approach combines the high temperature resistance needed for glass powder adhesive with the structural integrity required for substrate stability.
2Loss of energy
If metal substrate is used for wavelength conversion device, then thermal conductivity is improved, but at high temperature the substrate experiences softening, deformation, and oxidization
Solution Approach 1:
The patent employs ceramic substrates that combine high temperature stability with adequate thermal conductivity. The ceramic material resists softening, deformation, and oxidization at high temperatures while maintaining structural integrity. The substrate may incorporate thermal management features such as heat dissipation structures or thermal interface materials to compensate for lower thermal conductivity compared to metal substrates.
3Ease of manufacture
If silica gel is used as adhesive for phosphor layer, then ease of manufacture is improved, but poor thermal conductivity and darkening at high temperature reduce device performance
Solution Approach 1:
The patent changes the chemical composition and physical properties of the adhesive material from silica gel to glass powder with appropriate softening point. This parameter change enables the adhesive to withstand high temperatures without darkening or degrading, while maintaining adequate bonding strength for phosphor layer attachment. The glass powder adhesive is formulated to sinter at temperatures compatible with ceramic substrates.
4Illumination intensity
If high power excitation light is used to increase brightness, then illumination intensity is improved, but thermal management becomes difficult and device stability decreases
Solution Approach 1:
The patent uses ceramic substrates with high temperature stability and incorporates thermal management features such as heat dissipation structures, thermal interface materials, and possibly active cooling systems. The ceramic material withstands the thermal load from high power excitation light without degrading, enabling sustained high brightness operation.
Solution Approach 2:
The patent may divide the wavelength conversion device into multiple segments or modules, each handling a portion of the thermal load. This segmentation allows for better heat distribution and management, preventing localized overheating while maintaining high overall brightness output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal stability, reduces the risk of cracking, simplifies production, and allows for optimal processing conditions for each phosphor material, resulting in improved performance and cost-effectiveness of the wavelength conversion device.
Implementation Method 1
the thermal conductivities of the ceramic materials are above 80 W/mK
Implementation Method 2
each of the plurality of wavelength conversion modules includes a ceramic carrier and a phosphor material carried on the ceramic carrier
Implementation Method 3
the reflective layer is a diffuse reflection layer which includes white scattering particles and a second glass body that adheres the white scattering particles together
Implementation Method 4
wherein the reflective layer is a total reflection film coated on the surface of the ceramic carrier
Data Source
AI summary
Disclosed are a wavelength conversion device, and a light source system and a projection system therefor. The wavelength conversion device comprises a supporting structure and a plurality of wavelength conversion modules arranged together, each wavelength conversion module comprising a ceramic carrier and a phosphor material provided thereon. The supporting structure ensures that the plurality of wavelength conversion modules remain fixed relative to one another. The light source system and the projection system both comprise the present wavelength conversion device. The use of ceramic material as the carrier for the phosphor material enables high temperature resistance, and prevents detachment of the phosphor material due to deformation at high temperatures. In addition, such a modular wavelength conversion device does not crack easily, and has a flexible design and shorter production cycle.