Ceramic Support Wire Mounting With Twisted Terminal Openings

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Solution Overview

Problem

The challenge in manufacturing substrate support assemblies lies in the manual soldering of wires to terminals at high temperatures, which leads to manufacturing variability, frequent wire detachment, and reduced reliability due to intermetallic compound formation, especially when using reflow processes.

Innovation Solution

A method involving terminals with elongated openings through which wires are threaded, looped, and twisted to ensure mechanical stability and electrical contact, optionally reinforced with solder or conductive epoxy, allowing attachment at lower temperatures and improving manufacturability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual soldering is performed at high temperatures to attach wires to terminals, then electrical contact is achieved, but manufacturing variability increases and wire detachment occurs frequently

Engineering Contradiction:

Improvewire attachment reliabilityVSAvoidsoldering consistency

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces the thermal soldering process with a mechanical attachment method. Wires are threaded through elongated openings in terminals and secured using crimping or twisting mechanisms, eliminating the need for high-temperature soldering while maintaining reliable electrical and mechanical connections.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The elongated opening in the terminal acts as an intermediary structure that facilitates wire attachment. The opening allows the wire to be threaded through and provides a structured path for mechanical securing, enabling reliable connection without direct soldering.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If reflow processes are used to solder wires at high temperatures, then electrical contact is formed, but intermetallic compound formation increases and reduces reliability

Engineering Contradiction:

Improveconnection stabilityVSAvoidintermetallic compound formation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent eliminates the reflow soldering process entirely by using mechanical attachment methods. Wires are secured through crimping or twisting within the terminal structure, avoiding high-temperature exposure that causes intermetallic compound formation while maintaining stable electrical connections.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts and removes the harmful high-temperature soldering step from the manufacturing process. By using mechanical attachment through elongated openings, the process eliminates the source of intermetallic compound formation while preserving the essential function of electrical connection.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If traditional soldering methods are used, then wires are attached to terminals, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvewire attachment simplicityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent replaces complex thermal soldering processes with simpler mechanical attachment operations. The elongated opening structure enables straightforward wire threading followed by crimping or twisting, reducing manufacturing steps and equipment requirements while improving ease of production.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances manufacturing yield and part reliability by ensuring consistent electrical contact and mechanical strength while reducing thermal interference, thus lowering costs and improving substrate support assembly performance.

Implementation Method 1

an electrically bonding material deposited at the distal end of the second portion of each of the terminals

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 2

the openings of the terminals thermally decouple the respective wires from the ceramic plate during processing of a substrate

Methodology Applied

Scientific EffectThermal decoupling: Thermal Insulation

Data Source

PatentUS20260074165A1Method of mounting wires to substrate support ceramic

Publication Date: 2026.03.12 LAM RES CORP

AI summary

A method of attaching wires to a ceramic plate includes arranging a plurality of slots on the ceramic plate, arranging a plurality of electrically conducting terminals in the plurality of slots, respectively, and connecting the base portions of the terminals to the ceramic plate. Each terminal includes a base portion, a second portion, and an opening in the second portion extending to a distal end of the second portion. The method comprises connecting a plurality of wires to the distal ends by threading each of the wires through the opening of the respective terminal, folding each of the wires around the distal end into two halves, looping each of the wires around the distal end, and in each of the wires, twisting the two halves around each other from the distal end of the second portion of the respective terminal to distal ends of the two halves.