Ceramic Wiring Board Outrigger Grid for High-Temperature Sensor Interface
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Solution Overview
Problem
Current technologies are limited in rapidly and cost-effectively integrating high-temperature sensors with standard high-temperature data acquisition electronics, particularly for applications above 200°C, such as seismic measurements in geothermal exploration, where existing solutions do not provide a suitable interface for emerging high-temperature geophones.
Innovation Solution
A multi-layer ceramic wiring board with outrigger connection grid arrays is used to enable rapid and low-cost interfacing of high-temperature sensors with standard data acquisition electronics, featuring surface-mounted device footprints for active and passive components, and additive manufacturing techniques for efficient interconnects, allowing direct wire bonding and post-fire printed connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If custom analog interface circuits are designed for each high-temperature sensor, then the sensor can be interfaced with data acquisition electronics, but the production time and cost increase significantly
Solution Approach 1:
The patent implements a universal ceramic circuit board design with standardized outrigger connection grid arrays that can interface multiple different high-temperature sensors with standard data acquisition electronics. The board features reusable component footprints and grid arrays that accommodate various sensor types without requiring custom circuit board designs for each sensor, thereby reducing production time while maintaining adaptability.
Solution Approach 2:
The circuit board is pre-configured with outrigger connection grid arrays and component footprints during manufacturing, establishing a ready-to-use interface framework before the specific sensor is selected. This preliminary preparation eliminates the need for custom circuit design and fabrication for each sensor application, significantly reducing production time while maintaining versatility through the standardized grid architecture.
2Adaptability or versatility
If custom analog interface circuits are designed for each high-temperature sensor, then the sensor can be interfaced with data acquisition electronics, but the manufacturing cost increases
Solution Approach 1:
The circuit board employs a universal design with standardized outrigger connection grid arrays that can serve multiple different high-temperature sensor applications. This universality allows a single board design to be manufactured in volume for various sensor types, reducing per-unit manufacturing costs through economies of scale while maintaining the adaptability to interface with different sensors through the standardized grid connection system.
3Ease of manufacture
If internal ceramic wiring board modification is used for connections, then component pads can be connected, but the manufacturing complexity and time increase
Solution Approach 1:
The patent resolves the contradiction by moving connections from the internal dimension of the ceramic board to the external surface dimension. Outrigger connection grid arrays are implemented on the board surface rather than embedding complex internal wiring, allowing connections to be made through surface-mounted vias and external traces. This dimensional shift simplifies the ceramic wiring board structure while maintaining ease of manufacture through surface-level connection implementation.
Solution Approach 2:
The connection functionality is extracted from the internal ceramic structure and placed on the board surface as outrigger grid arrays. This extraction eliminates the need for complex internal ceramic wiring modifications, reducing manufacturing complexity and time while maintaining the ability to implement connections through surface-mounted vias and external trace routing.
Data Source
AI summary
A multi-layer ceramic wiring board is patterned with arrays of footprints for high-temperature surface mounted device active and passive components on one side of the board that is patterned with arrays of standard SMD footprints to enable placement and attachment of components including primary 2-terminal components and active components where the SMD pads are connected through vias and buried-layer interconnect traces to a multiple connection point arrays on the front and back side of the ceramic wiring board. Each pad is connected to multiple instances of the pad grid to connections to be made with a single post-fired print.