Ceramic Wiring Substrate with Laser-Textured Side Surfaces

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Solution Overview

Problem

Ceramic wiring substrates with smooth groove surfaces and fracture surfaces pose challenges for reliable chucking and positioning during conveyance and placement, leading to potential slippage and misalignment issues with conventional chucking and positioning tools.

Innovation Solution

The formation of an uneven surface on the side surfaces and inner walls of dividing grooves in ceramic wiring substrates, achieved through laser irradiation processes, creates a textured surface that allows for reliable chucking and positioning by providing a secure grip for claws and positioning jigs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a blade is used to form dividing grooves in a multi-piece wiring substrate array, then breakage and burrs at metal layers are reduced, but the side surfaces develop smooth groove surfaces that cause slippage during chucking and positioning

Engineering Contradiction:

Improvequality of dividing groove surfaceVSAvoidchucking reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The invention applies different surface qualities to different regions of the side surface. The groove portions maintain smooth surfaces for manufacturing quality, while adding rough portions at specific locations to provide enhanced friction for reliable chucking and positioning. This local differentiation resolves the contradiction between smooth groove surfaces and reliable gripping.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The side surface is segmented into distinct smooth groove portions and rough portions. The rough portions are created by projecting the dividing groove patterns from the opposite side surface, creating discrete rough zones that provide gripping points without compromising the overall smooth groove quality formed by the blade.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If a blade is used to form dividing grooves in a multi-piece wiring substrate array, then breakage and burrs at metal layers are reduced, but positioning accuracy deteriorates due to slippage on smooth surfaces

Engineering Contradiction:

Improvequality of dividing groove surfaceVSAvoidpositioning accuracy

Core Design Contradiction:

Manufacturing precisionVSMeasurement precision

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

3Device complexity

If conventional chucking apparatus with standard claw length is used, then device complexity is reduced, but chucking fails due to slippage on smooth groove surfaces

Engineering Contradiction:

Improvesimplicity of chucking apparatusVSAvoidchucking reliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The wiring substrate array provides its own chucking enhancement features through the rough portions on its surface. Instead of requiring the chucking apparatus to have complex features (long claws or special gripping mechanisms), the substrate itself provides the necessary friction through its surface topology, allowing simple apparatus to achieve reliable chucking.

Inventive Principle:

Principle #25Self-service

4Device complexity

If positioning jig is designed to accommodate smooth groove surfaces, then device complexity is reduced, but positioning fails due to slippage during insertion

Engineering Contradiction:

Improvesimplicity of positioning jigVSAvoidpositioning accuracy

Core Design Contradiction:

Device complexityVSMeasurement precision

Solution Approach 1:

The wiring substrate array provides its own positioning enhancement features through the rough portions on its surface. Instead of requiring the positioning jig to have complex gripping features, the substrate itself provides the necessary friction through its surface topology, allowing simple jigs to achieve accurate positioning.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The uneven surface enables reliable chucking and accurate positioning of ceramic wiring substrates, enhancing productivity by preventing slippage and ensuring proper alignment, even with shorter claws and positioning jigs, and allowing for effective accommodation in product trays.

Implementation Method 1

a laser beam is irradiated onto a green sheet laminate so that dividing grooves are formed thereby

Methodology Applied

Scientific EffectLaser heating: Laser

Data Source

PatentEP2701470B1Wiring board, multi-pattern wiring board, and method for producing same

Publication Date: 2019.06.19 NITERRA CO LTD

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AI summary

Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate 1a is formed of a ceramic material S, has a square (rectangular) shape in plan view, and which has a front surface 2, a back surface 3, and side surfaces 4 each being located between the front surface 2 and the back surface 3, wherein each side surface 4 has a belt-like uneven surface 5 including a plurality of alternate and parallel convex portions 7 and concave portions 6 which are formed so as to extend along the front surface 2, and also has a fracture surface 8 located on a side toward the back surface 3.