Cerium Oxide Composite Powder for High-Rate, Low-Damage CMP

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Solution Overview

Problem

Existing CMP processes for semiconductor devices face issues with slow removal rates and long processing times due to the limitations of current CMP slurries, and the use of ceria abrasive particles with surface modifications or hydroxide particles fails to adequately combine mechanical and chemical polishing effects, leading to aggregation and substrate damage.

Innovation Solution

A dispersion composition is developed using first cerium oxide particles with a prismatic shape and excellent crystallinity, and second cerium oxide particles with a spherical shape and surface activation, both separately dispersed to enhance mechanical and chemical polishing effects, with controlled density and specific size ratios to prevent aggregation and improve stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If surface-modified colloidal ceria abrasive particles are used with small ceria particles coating large ceria particles, then chemical activity is improved, but mechanical properties cannot be sufficiently exhibited and polishing rate cannot be sufficiently improved

Engineering Contradiction:

Improvechemical activityVSAvoidpolishing rate

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The invention segments the particle population into distinct size groups (large particles ≥0.5 μm for mechanical action, small particles <0.5 μm for chemical action) rather than using a coated structure. This allows each particle type to independently exhibit its primary function without the small coating particles interfering with the mechanical properties of large particles.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention merges two separate particle populations with different functions into a single dispersion composition. Large ceria particles provide mechanical polishing action while small ceria particles provide chemical polishing action, achieving both effects simultaneously in one system without requiring core-shell structures.

Inventive Principle:

Principle #5Merging (Combining)

2Object-affected harmful factors

If hydroxide particles of tetravalent metal element with limited density are used, then polishing damage is reduced and polishing rate is improved, but crystallinity is poor and mechanical properties cannot be sufficiently exhibited

Engineering Contradiction:

Improvepolishing damageVSAvoidmechanical properties

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The invention changes the material composition from hydroxide particles to ceria oxide particles, which inherently provide both the desired low polishing damage and excellent crystallinity. This parameter change resolves the contradiction by finding a material that simultaneously satisfies both requirements without compromising mechanical properties.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If mixture of different particles including cerium oxide and hydroxides of tetravalent metal is used, then polishing performance is improved, but aggregation occurs and scratches may occur during CMP

Engineering Contradiction:

Improvepolishing performanceVSAvoidaggregation and scratches

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The invention uses homogeneous ceria oxide particles of different sizes instead of mixing dissimilar cerium oxide and hydroxide particles. This homogeneity prevents aggregation issues and scratch formation while maintaining improved polishing performance through the size-differentiated particle population.

Inventive Principle:

Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves a high polishing rate without substrate damage and maintains stability over time, offering improved mechanical and chemical polishing properties through synergistic abrasive action.

Implementation Method 1

first particles exhibiting a strong mechanical action

Methodology Applied

Scientific EffectMechanical action: Abrasion

Implementation Method 2

second particles exhibiting a strong chemical action

Methodology Applied

Scientific EffectChemical action: Chemical Bonding

Implementation Method 3

the second cerium oxide particles smaller than the first cerium oxide particles are shaped to have an increased specific surface area to maximize chemical effects on the insulating film

Methodology Applied

Scientific EffectHydrothermal synthesis: Hydrolysis

Data Source

PatentUS12454630B2Dispersion composition of cerium oxide composite powder

Publication Date: 2025.10.28 ADVANCED NANO PROD CO LTD

AI summary

Proposed are cerium oxide composite powder and a dispersion composition containing the same powder. The powder includes two types of cerium oxide particles satisfying different specific particle size ranges. When the average density of the cerium oxide composite powder in a dispersion composition solution is controlled to be in a specific range, the dispersion composition can provide a high polishing rate without causing damage to a substrate and has good storage stability.