Ceria Particle Removal Composition for Semiconductor Cleaning
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Solution Overview
Problem
Current post-CMP cleaning methods for semiconductor surfaces leave residues and are inefficient, particularly in removing ceria particles, which affects the STI process and results in high material loss and increased costs due to prolonged process times and hazardous chemicals.
Innovation Solution
A composition comprising an anionic surfactant, an organic amine compound, and a protic organic acid molecule with specific structural and functional characteristics, such as capryleth-9 carboxylic acid, cysteamine, and hydroxyethane-1,1-diphosphonic acid, is used to effectively remove ceria particles by forming a composition with a pH of less than 6, enhancing ceria removal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning agents (citric acid, SC1, DHF, SPM) are used to remove ceria particles, then cleaning capability is achieved, but residues remain on the wafer surface
Solution Approach 1:
The invention changes the chemical parameters of the cleaning composition by using a specific combination of organic amine compound (with SENG > -1.0) and protic organic acid molecule (with DBM ≥ 0.013) at controlled concentrations to achieve pH 2-5. This parameter optimization enables effective ceria particle removal while preventing residue formation, resolving the contradiction between cleaning capability and surface cleanliness.
2Reliability
If dilute hydrofluoric acid (DHF) is used for cleaning, then ceria particles can be removed, but prolonged exposure causes high material loss
Solution Approach 1:
The invention replaces the hazardous and material-damaging DHF with a biodegradable organic amine compound and protic organic acid system that achieves ceria removal through controlled chemical reaction without causing excessive material loss. The composition acts as a disposable, environmentally friendly alternative that maintains cleaning effectiveness while protecting the substrate.
3Reliability
If SPM (sulfuric acid and hydrogen peroxide) is used for cleaning, then cleaning effectiveness is achieved, but process time increases and equipment requirements increase
Solution Approach 1:
The invention optimizes the chemical composition parameters by selecting organic amine compounds with SENG > -1.0 and protic organic acid molecules with DBM ≥ 0.013, creating a system that achieves rapid ceria particle removal at pH 2-5. This parameter optimization reduces process time and eliminates the need for complex equipment while maintaining cleaning effectiveness.
4Productivity
If ceria particles are used for polishing, then TEOS removal rate increases, but removal of ceria particles from SiO2 becomes difficult
Solution Approach 1:
The invention introduces an organic amine compound as a intermediary agent that facilitates the removal of ceria particles from SiO2 surfaces. The amine compound mediates the chemical interaction between the cleaning composition and ceria particles, enabling effective removal despite the strong adhesion forces between ceria and SiO2, thus resolving the contradiction between high polishing productivity and ease of particle removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively removes ceria particles from semiconductor surfaces, reducing defects and material loss while offering a safer and more flexible cleaning process compared to traditional methods, with improved ceria removal performance and cost efficiency.
Implementation Method 1
an anionic surfactant... which reduces the surface tension of water and enhances wetting
Implementation Method 2
an organic amine compound... having a sum of electronegativity gradients (SENG) greater than −1.0
Implementation Method 3
a protic organic acid molecule... having at least one dissociated complexing functional group where a density of binding modes for the functional group(s) of the molecule (DBM) is equal or greater than 0.013
Data Source
AI summary
To provide a composition for rinsing or cleaning a surface to which ceria particles are attached and a surface treatment method for removing ceria particles from the surface using the same.The composition according to the present invention contains an anionic surfactant, an organic amine compound, and a protic organic acid molecule and has a pH of less than 6.