Cermet Bushing Filter for Implantable Devices
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Solution Overview
Problem
Existing electrical bushings for implantable medical devices face challenges in achieving hermetic sealing and efficient manufacturing due to difficulties in metallizing internal surfaces for lead wire connections, leading to complex and error-prone soldering processes.
Innovation Solution
The development of an electrical bushing with a cermet-containing conducting element that forms a continuous structure within the insulating base body, providing a hermetically sealed ohmic connection with low resistance and integrating an electrical filter structure, which simplifies the manufacturing process and reduces reject rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional metallization and soldering processes are used to connect lead wires to the insulating base body, then electrical connection is achieved, but the manufacturing process becomes complex and error-prone with additional components and laborious steps
Solution Approach 1:
The patent combines the metallization layer and the connecting element into a single integrated component. The metallization layer is formed directly on the lead wire, eliminating the need for separate metallized insulator bore holes and solder rings. This merging of functions reduces the number of components and simplifies the manufacturing process while maintaining hermetic sealing quality.
Solution Approach 2:
The patent extracts and eliminates unnecessary intermediate components from the traditional assembly process. By removing solder rings and separate metallization steps, the design achieves direct connection between the lead wire and the insulating base body through a simplified metallization-only approach, reducing manufacturing complexity and potential error sources.
2Reliability
If metallization of internal surface is performed to attach lead wires, then electrical connection is established, but the process requires expensive procedures and additional components like solder rings
Solution Approach 1:
The metallization layer serves dual functions: it provides both the electrical connection pathway and the mechanical attachment surface for the lead wire. This eliminates the need for separate solder rings and expensive metallization procedures on the insulator, reducing manufacturing costs while maintaining connection durability through the integrated metallized structure.
3Reliability
If multiple soldering steps are used to connect various components, then electrical connections are established, but the process is laborious and difficult to automate
Solution Approach 1:
The patent removes multiple soldering steps from the manufacturing process by using a single metallization approach. The metallized lead wire structure allows for direct connection without requiring multiple automated soldering operations, making the process more amenable to automation while maintaining electrical connection integrity through the robust metallized interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a high-precision, low-reject-rate manufacturing process for electrical bushings with improved hermetic sealing and reduced complexity in connecting lead wires, enhancing the reliability and efficiency of implantable medical devices.
Implementation Method 1
The conducting element (30) is set up to establish, through the base body (40), at least one electrically conductive connection between an internal space and an external space
Implementation Method 2
firing the at least one green compact at temperatures between 800° C. and 1800° C. to form the at least one conducting element
Data Source
AI summary
One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element is set up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet.The electrical bushing includes an electrical filter structure. The at least one conducting element forms at least one electrically conducting surface of the filter structure.