Cermet Electrical Bushing for Implantable Medical Devices
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Solution Overview
Problem
Existing electrical bushings for implantable medical devices face challenges in achieving a durable and hermetically sealed connection between metal lead wires and ceramic base bodies, requiring expensive and laborious metallization and soldering processes, which are difficult to automate.
Innovation Solution
The use of a cermet-containing electrical bushing with a feedthrough element and connecting element made from the same material, integrated as a single part through sintering, to establish a hermetic and conductive connection between the internal and external spaces of the device, reducing the need for additional soldering and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metallization and soldering processes are used to connect lead wires to ceramic base bodies, then hermetic sealing and electrical connection are achieved, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The patent combines the feedthrough element and connecting element into a single integrated component made of cermet material. This merging eliminates the need for separate metallization and soldering processes, as the cermet material provides both hermetic sealing and electrical conductivity in one integrated structure. The single-part construction directly resolves the contradiction by reducing manufacturing process complexity while maintaining reliability.
Solution Approach 2:
The patent employs cermet (ceramic-metal composite) material for the feedthrough and connecting elements. This composite material combines the hermetic sealing properties of ceramic with the electrical conductivity of metal, eliminating the need for separate metallization layers and solder joints. The cermet material itself provides both sealing and conductive functions, simplifying the manufacturing process while ensuring reliable performance.
2Reliability
If metallization and soldering processes are used to connect lead wires to ceramic base bodies, then hermetic sealing and electrical connection are achieved, but manufacturing time increases and automation becomes difficult
Solution Approach 1:
By merging the feedthrough element and connecting element into a single cermet component, the patent eliminates multiple manufacturing steps including metallization and soldering. This integration enables the entire assembly to be manufactured in fewer steps, increasing productivity and making the process suitable for automation while maintaining hermetic sealing reliability.
Solution Approach 2:
The patent changes the material parameter from traditional metal-to-ceramic connections to cermet-to-ceramic integration. This material parameter change fundamentally alters the manufacturing approach, allowing for reduced cycle times and simplified processes that can be automated, thereby improving productivity without compromising hermetic sealing.
3Ease of manufacture
If traditional metal-to-ceramic connection methods are used, then electrical connection is established, but connection reliability decreases due to soldering failures
Solution Approach 1:
The patent uses cermet material that inherently provides both electrical conductivity and hermetic sealing capability. This composite material eliminates the need for solder joints, as the cermet itself forms a reliable, failure-resistant connection. The material composition directly addresses the reliability issue by providing a connection method that is inherently more durable than soldered joints.
Solution Approach 2:
The patent employs a disposable, integrated cermet component that is manufactured as a single part and does not require complex assembly or soldering. This approach replaces unreliable solder connections with a monolithic cermet structure that is both easier to manufacture and more reliable, as it eliminates the weak points associated with solder joints.
4Adaptability or versatility
If separate feedthrough element and connecting element are used, then flexibility in design is maintained, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the feedthrough element and connecting element into a single cermet component, which simplifies manufacturing while maintaining design flexibility. The integrated structure can still be configured to meet various design requirements through the cermet material's properties, eliminating the need for separate components and their associated assembly processes.
Solution Approach 2:
The cermet material serves multiple functions simultaneously: it provides electrical conductivity, hermetic sealing, and mechanical structural integrity. This multi-functionality eliminates the need for separate components, simplifying manufacturing while maintaining the ability to meet various design specifications through material property selection rather than component configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more cost-effective, reliable, and automated manufacturing method for electrical bushings with improved hermetic sealing and reduced risk of solder connection failures, enhancing the durability and service life of the medical device.
Implementation Method 1
integrated as a single part through sintering
Data Source
AI summary
One aspect relates to an electrical bushing for use in a housing of an active implantable medical device. The electrical bushing includes an electrically insulating base body and an electrical conducting element. The conducting element is set up to establish, through the base body, an electrically conducting connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, and the conducting element includes a cermet.