Cermet Feedthrough Wire Connection Microstructure
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Solution Overview
Problem
Conventional methods for connecting wires to feedthroughs in implantable medical devices are costly and time-consuming, requiring bond pads and masking of surrounding surfaces, which complicates the manufacturing process and increases component count.
Innovation Solution
A method using a feedthrough system with an insulating matrix and an electrically conductive cermet pathway, where the wire forms a joint microstructure with the cermet pathway through heat generation, eliminating the need for bond pads and masking, and allowing for a stable and conductive connection with low metal content.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond pads and masking are used for connecting wire to feedthrough, then connection stability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts and eliminates the bond pad layer and masking step from the conventional connection process. By directly contacting the wire with the cermet pathway in the feedthrough, the patent removes these intermediate components and processes while maintaining connection stability through the inherent properties of the cermet material and direct contact interface.
Solution Approach 2:
The cermet pathway serves as an intermediary structure that combines the functions of both the bond pad and the feedthrough conductive pathway. The cermet material provides both the bonding surface for wire attachment and the hermetically sealed conductive pathway, eliminating the need for separate bond pad and masking layers.
2Reliability
If bond pads and masking are used for connecting wire to feedthrough, then connection stability is improved, but manufacturing time increases
Solution Approach 1:
The invention extracts and eliminates the bond pad layer and masking step from the conventional connection process. By directly contacting the wire with the cermet pathway in the feedthrough, the patent removes these intermediate components and processes while maintaining connection stability through the inherent properties of the cermet material and direct contact interface.
Solution Approach 2:
The cermet pathway enables continuous functionality by integrating the bonding surface and conductive pathway into a single hermetically sealed structure. This eliminates the need for separate bonding and sealing processes, allowing the connection to be established in a single continuous operation rather than through multiple discrete steps.
3Reliability
If bond pads and masking are used for connecting wire to feedthrough, then connection stability is improved, but component count increases
Solution Approach 1:
The invention merges the functions of the bond pad, masking layer, and feedthrough conductive pathway into a single integrated cermet pathway structure. The cermet material provides both the bonding surface for wire attachment and the hermetically sealed conductive pathway, reducing the component count while maintaining connection stability.
Solution Approach 2:
The cermet pathway serves multiple functions simultaneously: it provides a bonding surface for wire attachment, establishes an electrically conductive pathway, and provides hermetic sealing. This multi-functionality eliminates the need for separate bond pads, masking layers, and conductive pathways, reducing the overall component count.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of components and manufacturing steps while maintaining stability and conductivity, enabling a cost-effective and efficient connection between the wire and the feedthrough.
Implementation Method 1
generating a joint microstructure comprising the material of the cermet pathway and the material of the wire
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The application relates to a method of connecting a wire (20) to a feedthrough (30). Moreover, the application relates to a feedthrough system and to an implantable medical device comprising such a feedthrough system. The feedthrough system comprises a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one part forming an electrically conductive cermet pathway (10), i.e. forming an electrically conductive passage through a thickness of the feedthrough. The wire is at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure (22) with the electrically conductive material in the cermet pathway.