Carbon Fiber Composite Wafer Surface Roughness Control
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Solution Overview
Problem
Carbon fiber composite wafers face challenges in achieving high strength and low surface roughness, particularly in micrometer-sized features, due to difficulties in machining and high surface roughness, which limits their applications.
Innovation Solution
A carbon fiber composite wafer with a thickness of 10-500 micrometers and a root mean square surface roughness of less than 300 nm is achieved by embedding carbon fibers in a matrix and using a method involving pressing a stack of CFC sheets between pressure plates with a porous breather layer and heating to cure, resulting in a wafer with high yield strength and low surface roughness, suitable for x-ray window support structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If carbon fiber composite wafers are used for high strength applications, then strength is improved, but surface roughness increases
Solution Approach 1:
The patent applies parameter changes by controlling the curing temperature (at least 50°C) and pressure conditions during manufacturing to achieve a balance between strength and surface roughness. The curing process parameters are optimized to produce a smooth surface while maintaining high yield strength greater than 0.5 GPa.
Solution Approach 2:
The patent uses carbon fiber composite material consisting of carbon fibers embedded in a matrix, combining the high strength properties of carbon fibers with a matrix material that provides smooth surface characteristics when properly cured.
2Strength
If carbon fiber composite wafers are used for micrometer-sized features, then strength is improved, but machining difficulty increases
Solution Approach 1:
The patent applies preliminary action by pre-curing the carbon fiber composite wafer before machining operations. The wafer is cured to full or partial strength before attempting to machine micrometer-sized features, which significantly reduces machining difficulty and prevents damage to the brittle cured material.
Solution Approach 2:
The patent changes the physical state parameter of the composite material through controlled curing at temperatures of at least 50°C, transforming the material from a uncured state that is easy to machine to a cured state that provides the required strength for micrometer-sized features.
3Strength
If carbon fiber composite wafers are used for high strength applications, then yield strength is improved, but surface roughness increases
Solution Approach 1:
The patent applies parameter changes by controlling the curing temperature (at least 50°C) and pressure conditions during manufacturing to achieve a balance between strength and surface roughness. The curing process parameters are optimized to produce a smooth surface while maintaining high yield strength greater than 0.5 GPa.
Solution Approach 2:
The patent uses carbon fiber composite material consisting of carbon fibers embedded in a matrix, combining the high strength properties of carbon fibers with a matrix material that provides smooth surface characteristics when properly cured.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a carbon fiber composite wafer with high strength and low surface roughness, enabling improved adhesion and performance in applications such as x-ray window support structures, with a yield strength greater than 0.5 gigapascals and strain at fracture greater than 0.01, while maintaining low surface roughness for enhanced film compatibility.
Implementation Method 1
pressing a stack of at least one sheet of CFC between pressure plates with a porous breather layer disposed between at least one side of the stack and at least one of the pressure plates
Implementation Method 2
heating the stack to a temperature of at least 50° C. to cure the stack into a CFC wafer
Data Source
AI summary
A high strength carbon fiber composite (CFC) wafer, and method of making such wafer, with low surface roughness comprising at least one sheet of CFC including carbon fibers embedded in a matrix. The wafer can have a thickness of between 10-500 micrometers. The wafer can have a root mean square surface roughness Rq, on at least one side, of less than 300 nm in an area of 100 micrometers by 100 micrometers and less than 500 nm along a line of 2 millimeter length. The wafer may be cut to form x-ray window support structures, MEMS, or other micrometer sized structures.