Conductive Layer and Jumper for CFRP Electrical Grounding
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Solution Overview
Problem
Carbon-fiber-reinforced plastic (CFRP) structures lack conductivity due to a non-conductive resin layer covering the carbon fibers, preventing them from serving as a grounding point for electronic devices attached to their surface.
Innovation Solution
Incorporating a conductive layer laminated onto the carbon-fiber prepreg and using a jumper to penetrate through both the conductive layer and the prepreg, allowing direct electrical connection to a reference potential point, thereby enabling grounding without the need for additional wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a CFRP structure is used for weight reduction and strength reinforcement, then the structural performance is improved, but the electrical conductivity is lost due to the non-conductive resin layer covering the carbon fibers
Solution Approach 1:
The invention divides the CFRP structure into functionally distinct regions: a conductive carbon fiber layer for electrical grounding and a non-conductive resin layer for structural protection. The conductive layer is exposed at specific locations to provide electrical contact while the resin layer covers other areas for structural integrity, allowing both functions to coexist without compromising either strength or conductivity.
Solution Approach 2:
The invention applies different surface properties to different locations of the CFRP structure. The resin layer is removed or not applied at specific grounding locations to expose the conductive carbon fibers, while maintaining the resin layer at other locations for structural protection. This local differentiation allows the structure to provide both structural strength and electrical grounding functionality.
2Stability of the object's composition
If the entire surface is covered with resin layer for structural integrity, then the structural performance is improved, but the ability to electrically ground electronic devices is lost
Solution Approach 1:
The surface coating is segmented into resin-covered areas for structural integrity and resin-free areas for electrical grounding. This segmentation allows the CFRP structure to maintain its structural integrity while providing specific zones that can electrically ground electronic devices attached to the surface.
Solution Approach 2:
The CFRP structure is designed to serve multiple functions: structural support through the resin layer and electrical grounding through the exposed carbon fiber layer. By incorporating both functions into a single structure, the invention eliminates the need for separate grounding components while maintaining structural integrity.
3Reliability
If additional wiring is added to provide grounding function, then the electrical grounding capability is improved, but the device complexity and installation cost increase
Solution Approach 1:
The CFRP structure itself serves as the grounding path by exposing the conductive carbon fiber layer at specific locations. This eliminates the need for separate wiring systems, reducing device complexity and installation cost while maintaining reliable electrical grounding capability.
Solution Approach 2:
The CFRP structure provides its own grounding function through the exposed carbon fiber layer, eliminating the need for external grounding wires or additional grounding components. The structure serves itself as the grounding path, simplifying the overall system and reducing installation complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the secondary function of electrical grounding of electronic devices on CFRP structures, enhancing their functionality while simplifying the installation process and reducing costs by eliminating the need for masking and pre-processing steps.
Implementation Method 1
a conductive layer laminated and formed on a carbon-fiber prepreg; and a jumper formed of a conductor which penetrates through the conductive layer and the carbon-fiber prepreg
Implementation Method 2
heating a carbon-fiber prepreg formed by laminating a plurality of sheets, each of which has a carbon fiber impregnated with a thermosetting resin, and hardening the thermosetting resins to integrate the plurality of sheets
Data Source
Figure 1
Figure 2~3
Figure 4A~4C
AI summary
This carbon-fiber-reinforced plastic structure includes: an electroconductive layer (233) formed by being laminated on a carbon-fiber prepreg (231); and an electric-conductor-made jumper (24) that penetrates through the electroconductive layer (233) and the carbon-fiber prepreg (231).