Semiconductor Chamber Airflow Switching for Inert Maintenance
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Solution Overview
Problem
In semiconductor manufacturing, the accumulation of deposited reactants in the reaction chamber can lead to defects on the wafer surface and unintended chemical reactions when the chamber is exposed to the atmosphere, posing challenges in maintaining the chamber effectively.
Innovation Solution
The method involves controlling the airflow paths within the semiconductor manufacturing device by using an air intake pipe and an air jet pipe, which can be connected to form a first airflow path. A negative pressure generating device is used to create a second airflow path when the first is cut off, allowing for the removal of residual gaseous raw materials and prevention of atmospheric exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the reaction chamber is opened for maintenance to remove accumulated deposited reactant, then the deposited reactant can be cleaned, but foreign objects may fall and the reaction chamber is exposed to atmospheric gas causing unintended chemical reactions
Solution Approach 1:
The patent introduces a protective gas (such as nitrogen or argon) into the reaction chamber before opening the chamber for maintenance. This inert atmosphere prevents atmospheric gases from contacting the deposited reactant, thereby avoiding unintended chemical reactions while allowing safe maintenance operations
Solution Approach 2:
The system performs preliminary actions by automatically pumping out residual reactant gas and introducing protective gas before the chamber is opened for maintenance. This preliminary preparation ensures that when the chamber is opened, the harmful reactions have already been prevented
2Reliability
If the air intake pipe remains connected to the air jet pipe to maintain airflow, then the air intake pipe stays clean, but atmospheric gas can enter and react with deposited reactant when the chamber is opened
Solution Approach 1:
The patent makes the connection between the air intake pipe and air jet pipe dynamic rather than static. The connection is automatically disconnected when maintenance is needed, allowing the system to adapt its configuration based on operational requirements. This dynamic adjustment prevents atmospheric contamination while maintaining pipe cleanliness through automated control
Solution Approach 2:
The system extracts or disconnects the air intake pipe from the air jet pipe connection before opening the chamber for maintenance. This separation removes the potential pathway for atmospheric gas to enter and react with deposited reactant, while the pipe cleanliness is maintained through the automated pumping and protective gas introduction
3Reliability
If automated control is implemented to manage airflow paths and negative pressure generation, then maintenance safety is improved, but device complexity increases
Solution Approach 1:
The system implements self-service automation where the controller automatically manages the disconnection of airflow paths, activation of negative pressure generation, and introduction of protective gas without requiring complex manual intervention. The automated control reduces maintenance safety risks while keeping the control system complexity manageable through standardized automation protocols
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents the reaction of deposited reactants with atmospheric gases, reduces the risk of wafer defects, and maintains the cleanliness of the air intake pipe by isolating it from the atmosphere and removing residual materials.
Implementation Method 1
turning on a negative pressure generating device at the air pumping terminal and pumping air from the air intake pipe
Implementation Method 2
pumping air from the air intake pipe
Data Source
AI summary
The present disclosure provides a method and an apparatus of controlling a semiconductor manufacturing device, a medium and a semiconductor manufacturing device. The method of controlling a semiconductor manufacturing device includes: receiving a control instruction, and cutting off or turning on a first airflow path; and when the first airflow path is cut off based on the control instruction, driving an air pumping terminal of an air pumping pipe to be connected to an air outlet terminal of an air intake pipe, and turning on a negative pressure generating device and pumping air from the air intake pipe; or when the first airflow path is turned on based on the control instruction, driving the air pumping terminal to be disconnected from the air outlet terminal of the air intake pipe, and turning off the negative pressure generating device and stopping pumping.