Semiconductor Chamber Arc Localization Using Optical Tomography
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Solution Overview
Problem
Existing semiconductor process devices face challenges in accurately determining and locating arcs during plasma-based semiconductor processes, which can damage wafers and affect device properties, as current methods are inefficient in detecting arc positions and intensities.
Innovation Solution
A semiconductor process device is equipped with optical pickup units and photodetectors that convert optical signals from the chamber into electrical signals, allowing a processor to generate spatial images of the chamber interior using tomography techniques, thereby accurately determining if an arc has occurred and its location.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical pickup units and photodetectors are used to detect arcs in the chamber, then arc detection precision and position identification accuracy are improved, but device complexity increases
Solution Approach 1:
The detection system is divided into multiple optical pickup units, each responsible for specific detection tasks (arc detection, position identification), allowing the complex detection function to be segmented into manageable modules that can be independently optimized and maintained
Solution Approach 2:
Optical fibers are introduced as intermediaries to transmit optical signals from the chamber environment to the photodetectors, enabling non-contact detection that simplifies the overall system architecture while maintaining high measurement precision
2Measurement precision
If multiple optical pickup units are mounted on chamber windows to generate spatial images, then arc position identification accuracy is improved, but device complexity increases
Solution Approach 1:
Multiple optical pickup units are positioned at different spatial locations and angles around the chamber, capturing optical signals from different dimensions. This multi-dimensional arrangement enables the generation of spatial images that accurately locate arcs in three-dimensional space
Solution Approach 2:
The patent combines multiple optical detection signals into a single spatial image through image processing techniques, merging the information from various optical pickup units to create a comprehensive view of arc positions without requiring separate analysis of each detector
3Reliability
If photodetectors convert optical signals to electrical signals for arc analysis, then detection reliability is improved, but device complexity increases
Solution Approach 1:
The system replaces complex mechanical scanning or moving detector systems with stationary photodetectors that continuously convert optical signals to electrical signals, improving reliability by eliminating moving parts while maintaining accurate arc detection capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the precision of arc detection and position identification, improving the yield of semiconductor processes by analyzing the effect of arcs on wafers and enabling targeted control measures.
Implementation Method 1
A plurality of first photodetectors configured to convert respective first optical signals transmitted by the plurality of first optical pickup units into electrical signals
Data Source
AI summary
A semiconductor process device includes a chamber housing defining an internal region and a plurality of electrostatic chucks within the internal region. The chamber housing includes a window, and a light collection unit including a first optical system and a second optical system located at different positions on the window. A plurality of first optical pickup units are connected to the first optical system, and a plurality of second optical pickup units are connected to the second optical system. A sensor includes a plurality of photodetectors that are configured to convert a first optical signal transmitted by the plurality of first optical pickup units and a second optical signal transmitted by the plurality of second optical pickup units into electrical signals. A processor is configured to generate a spatial image of the internal region of the chamber housing using the electrical signals output by the plurality of photodetectors, and determine a location at which an arc occurs in the internal region of the chamber housing based on the spatial image.