Chamber architecture for cooling devices
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Solution Overview
Problem
Current cooling solutions for mobile devices, such as smartphones and tablets, are inadequate in addressing the heat dissipation needs of high-performance processors, leading to throttling and reduced performance due to insufficient heat transfer and noise from electric fans.
Innovation Solution
A piezoelectric cooling system utilizing a MEMS-based chamber with a piezoelectric cooling element, an array of orifices, and valves that creates vibrational motion to increase or decrease chamber volume, allowing fluid to escape or enter, efficiently dissipating heat through high-speed fluid flow without noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electric fans are used for cooling, then heat dissipation is improved, but device size increases and noise is generated
Solution Approach 1:
The patent replaces the mechanical fan system with a piezoelectric-based acoustic wave generation system. The piezoelectric element converts electrical energy directly into mechanical vibrations that generate acoustic waves in the fluid, eliminating the need for rotating mechanical components and thereby eliminating noise while maintaining cooling effectiveness.
Solution Approach 2:
The patent changes the operating parameters from continuous rotational motion (fan) to high-frequency ultrasonic vibrations (piezoelectric element). By operating at frequencies above human hearing threshold (ultrasonic range), the system achieves effective fluid agitation and heat transfer without generating audible noise.
2Temperature
If electric fans are used for cooling, then heat dissipation is improved, but device size increases
Solution Approach 1:
The patent replaces the bulky mechanical fan assembly with a compact piezoelectric element integrated into the chamber structure. The piezoelectric element requires minimal space and can be fabricated using MEMS techniques, dramatically reducing the overall device volume while maintaining effective cooling capability.
Solution Approach 2:
The patent transitions from a three-dimensional rotating fan structure to a planar piezoelectric element that generates acoustic waves propagating through the fluid volume. This dimensional transformation allows for much more compact device architecture while maintaining effective heat dissipation throughout the fluid medium.
3Temperature
If throttling is applied to reduce heat, then heat generation is reduced, but processor speed decreases
Solution Approach 1:
The patent introduces an acoustic wave field as an intermediary between the heat source and heat dissipation mechanism. The piezoelectric element generates acoustic waves that agitate the fluid, enhancing convective heat transfer and enabling effective cooling without requiring processor throttling, thus maintaining full processing performance.
4Temperature
If heat spreaders or heat pipes are used, then heat transfer is improved, but cooling effectiveness is insufficient for high-performance devices
Solution Approach 1:
The patent employs mechanical vibrations in the form of ultrasonic acoustic waves generated by the piezoelectric element. These vibrations create intense fluid mixing and disrupt thermal boundary layers, achieving heat transfer coefficients far superior to passive heat spreaders and heat pipes, thereby providing reliable cooling for high-performance processors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The piezoelectric cooling system effectively dissipates heat, allowing devices to operate at higher speeds for longer periods with improved performance and reduced power consumption, suitable for small form factors like mobile devices.
Implementation Method 1
A vibrational motion of the piezoelectric cooling element causes an increase or decrease in the chamber volume as the piezoelectric cooling element is deformed
Implementation Method 2
The piezoelectric cooling element is in contact with a heat-generating structure to be cooled
Data Source
AI summary
A piezoelectric cooling chamber and method for providing the cooling system are described. The cooling chamber includes a piezoelectric cooling element, an array of orifices and a valve. A vibrational motion of the piezoelectric cooling element causes an increase or decrease in a chamber volume as the piezoelectric cooling element is deformed. The array of orifices is distributed on at least one surface of the chamber. The orifices allow escape of fluid from within the chamber during the decrease in the chamber volume in response to the vibration of the piezoelectric element. The valve is configured to admit fluid into the chamber when the chamber volume increases and to substantially prevent fluid from exiting the chamber through the valve when the chamber volume decreases.