Semiconductor Chamber Cleaning Receptacle for Aperture Particle Removal
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Solution Overview
Problem
Conventional cleaning systems for semiconductor chamber components are inadequate in removing residual microscopic particles from the apertures, which can cause conductive particles to dislodge and lead to shorting or damage during processing, as device sizes shrink and the complexity of patterned material production increases.
Innovation Solution
The proposed semiconductor chamber component cleaning system includes a receptacle with a bottom lid featuring an annulus and recessed annular ledges, a top lid with flexible seals and apertures, and a cleaning tank with a fluid delivery system that allows for push and pull fluid delivery through the component, utilizing ultrapure or deionized water at high flow rates, along with a liquid particle counter to determine when cleaning is complete.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning systems are used, then the cleaning process is simple, but residual microscopic particles remain in the apertures causing shorting or damage
Solution Approach 1:
The cleaning system is divided into multiple functional sections including a cleaning section with spray nozzles, a delivery section, and an overflow section. This segmentation allows each section to perform a specific cleaning function, improving particle removal effectiveness while maintaining manageable system complexity through modular design
Solution Approach 2:
The system uses hydraulic principles with fluid delivery pumps to circulate cleaning fluids through the receptacle and component apertures. The fluid delivery system creates controlled fluid flow to penetrate and remove particles from difficult-to-reach areas, significantly improving cleaning effectiveness and substrate processing reliability
2Reliability
If high flow rates of ultrapure water are used, then particle removal effectiveness increases, but fluid consumption increases
Solution Approach 1:
The cleaning system operates with continuous circulation of ultrapure water through the component and receptacle. The fluid delivery pump maintains continuous flow rather than intermittent spraying, ensuring consistent particle removal effectiveness while allowing for fluid recovery and reuse in the overflow and delivery sections, thereby reducing overall water consumption
Solution Approach 2:
The system separates cleaning fluid into different sections including an overflow section that collects used fluid. This allows for potential recovery and reuse of the ultrapure water after filtration, reducing the total consumption of expensive ultrapure water while maintaining high particle removal effectiveness during the cleaning process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system effectively reduces particle counts on substrates during semiconductor processing, ensuring high-quality component cleaning and preventing damage from residual particles, thereby improving the uniformity of material delivery and reducing the risk of shorting.
Implementation Method 1
a liquid particle counter to determine when cleaning is complete
Implementation Method 2
a cleaning tank with a fluid delivery system that allows for push and pull fluid delivery through the component
Data Source
AI summary
Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.