Substrate Processing Chamber Cleaning via Fluorination and Precursor Removal
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Solution Overview
Problem
Existing methods for cleaning substrate processing chambers and components using chlorine gas can cause damage and are inefficient, as they do not effectively remove metal-containing substances without generating residues.
Innovation Solution
A method involving the formation of a second metal-containing substance from a first metal-containing substance using a fluorine-containing gas, followed by its removal using a precursor gas, with optional heating and plasma generation to enhance the cleaning process, thereby reducing damage and increasing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chlorine gas is used for cleaning metal-containing substances from the chamber, then cleaning capability is achieved, but damage to the chamber or component occurs and residues are generated
Solution Approach 1:
The patent uses a fluorine-containing gas as an intermediary substance that first reacts with the metal-containing substance to form a volatile metal fluoride compound. This intermediate reaction product can then be easily removed by a subsequent precursor gas without causing damage to the chamber or component, thus resolving the contradiction between effective cleaning and damage prevention
Solution Approach 2:
The patent changes the chemical parameters of the cleaning process by using fluorine-containing gas instead of chlorine gas. This parameter change allows for selective reaction with metal-containing substances while avoiding the harmful effects of chlorine, thereby achieving effective cleaning without damage to the chamber or component surfaces
2Productivity
If chlorine gas is used for cleaning metal-containing substances, then cleaning is performed, but cleaning speed is low and residues remain
Solution Approach 1:
The fluorine-containing gas acts as a mediator that converts the metal-containing substance into a volatile metal fluoride intermediate. This intermediate form is much more easily removed by the subsequent precursor gas, significantly increasing cleaning speed and eliminating residues that would otherwise remain after chlorine-based cleaning
Solution Approach 2:
The patent utilizes phase transition by forming volatile metal fluoride compounds from the metal-containing substance. These volatile compounds can be easily evaporated and removed by the precursor gas, achieving fast cleaning without residues, in contrast to the slow and residue-generating chlorine-based method
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses damage to the chamber or component during cleaning, increases cleaning speed, and minimizes residue generation compared to chlorine-based methods, allowing for more thorough removal of metal-containing substances.
Implementation Method 1
forming a second metal-containing substance from a first metal-containing substance adhering to the chamber or the component by using a first processing gas including a fluorine-containing gas
Implementation Method 2
removing the second metal-containing substance by using a second processing gas including a precursor
Implementation Method 3
converting the mixed gas into plasma and performing cleaning
Data Source
AI summary
In one exemplary embodiment, a method for cleaning a chamber of a substrate processing apparatus or a component disposed in the chamber includes: (a) forming a second metal-containing substance from a first metal-containing substance adhering to the chamber or the component by using a first processing gas including a fluorine-containing gas in the chamber; and (b) removing the second metal-containing substance by using a second processing gas including a precursor in the chamber.