Chamber Cleaning Gas Deflector for Faster Semiconductor Cleans
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Solution Overview
Problem
The presence of unwanted particles and contamination in semiconductor process chambers, such as those used for SiCO deposition, can interfere with subsequent material depositions and lead to defects in semiconductor wafers, necessitating frequent and time-consuming cleaning processes that reduce manufacturing throughput.
Innovation Solution
A cleaning gas deflector is introduced in the process chamber to efficiently direct cleaning gas flow towards multiple regions, enhancing the cleaning process by ensuring effective coverage of both the top and bottom ends of the chamber, thereby reducing the frequency and duration of cleanings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If frequent cleaning is performed to remove particles and contamination, then cleaning effectiveness is improved, but manufacturing throughput deteriorates due to prolonged downtime
Solution Approach 1:
The cleaning process is segmented into multiple targeted zones using deflector plates that direct cleaning gas to specific regions (top end, bottom end, and sidewalls) of the process chamber. This segmentation allows simultaneous cleaning of multiple areas, reducing total cleaning time while maintaining effectiveness.
Solution Approach 2:
The deflector plates introduce a spatial dimension to cleaning gas distribution by directing flow along the sidewalls and to both top and bottom ends of the chamber. This multi-directional approach ensures comprehensive coverage without requiring prolonged single-point cleaning.
2Manufacturing precision
If extended cleaning duration is used to ensure thorough cleaning of all chamber regions, then cleaning completeness is improved, but manufacturing throughput deteriorates due to increased downtime
Solution Approach 1:
The deflector plates are pre-positioned to optimize cleaning gas distribution across all chamber regions before cleaning begins. This preliminary configuration ensures that cleaning gas is immediately directed to all necessary areas, eliminating the need for extended cleaning duration to achieve complete coverage.
Solution Approach 2:
The deflector plates act as intermediaries that redirect cleaning gas flow to reach difficult-to-access regions such as the bottom end and sidewalls of the process chamber. This intermediary structure enables thorough cleaning of all surfaces without requiring prolonged exposure times.
3Productivity
If cleaning gas flow is directed to multiple regions simultaneously, then cleaning efficiency is improved, but device complexity increases due to the deflector structure
Solution Approach 1:
The deflector plates serve multiple functions: they direct cleaning gas to the top end, bottom end, and sidewalls of the chamber, and can be configured to address different contamination patterns. This multi-functionality achieves comprehensive cleaning without requiring separate systems for each region.
Solution Approach 2:
The deflector plates are simple, easily replaceable components that can be manufactured at low cost. Their simplicity allows for easy installation and removal, minimizing the impact of the added structure on overall system complexity while maximizing cleaning efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The deflector allows for more efficient cleaning of the process chamber, minimizing downtime and increasing overall manufacturing throughput by ensuring thorough cleaning without prolonged interruptions.
Implementation Method 1
flowed cleaning gas impinging on the first surface
Data Source
AI summary
A method of fabricating semiconductor devices includes: loading one or more semiconductor wafers into a plurality of stations provided within a process chamber; applying a process to the semiconductor wafers which deposits a material on the one or more semiconductor wafers within the process chamber; and cleaning the process chamber. Suitably, cleaning the process chamber includes flowing a cleaning gas into the process chamber toward a deflector arranged in the process chamber, the deflector having a first surface upon which the flowed cleaning gas impinges, the first surface directing a first portion of the flowed cleaning gas impinging thereon in a first trajectory toward a first end of the process chamber and directing a second portion of the flowed cleaning gas impinging thereon in a second trajectory toward a second end of the process chamber, the second end being opposite the first end.