Multi-Mode Chamber Cleaning Nozzle for Electrostatic Particle Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional cleaning tools for semiconductor and flat panel display processing tools are inefficient in removing all types of particles, including those influenced by van der Waals or electrostatic forces, and cannot reach components with complex shapes, leading to prolonged downtime and reduced production yield.
Innovation Solution
A cleaning device with multiple contamination removal mechanisms, including a CO2 snow dispenser, ionizer, and ultrasonic gas dispenser, coupled with a vacuum channel and sensor system, allows for effective particle removal from complex chamber components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning tools are used, then the chamber can be cleaned, but particle removal effectiveness is insufficient especially for particles influenced by van der Waals or electrostatic forces
Solution Approach 1:
The cleaning device is divided into multiple independent contamination removal mechanisms (CO2 snow dispenser, ionizer, ultrasonic gas dispenser) that can be selectively activated. Each mechanism targets specific particle types or contamination scenarios, allowing the system to adapt to different cleaning challenges within the chamber.
Solution Approach 2:
The device changes physical parameters of the cleaning process by offering multiple mechanisms with different operating principles - CO2 snow provides cryogenic cleaning, ionizer applies electrostatic forces, and ultrasonic gas dispenser uses acoustic energy. This multi-parameter approach enables effective removal of particles that resist conventional single-method cleaning.
2Ease of operation
If conventional cleaning tools are used, then cleaning can be performed, but they cannot reach components with complex shapes
Solution Approach 1:
The device utilizes CO2 snow (cryogenic gas) and ultrasonic gas dispenser mechanisms that can penetrate and reach complex geometries, blind holes, and hard-to-access areas where conventional contact-based cleaning tools cannot reach, while maintaining effective cleaning action throughout the chamber.
Solution Approach 2:
The ultrasonic gas dispenser component generates high-frequency vibrations that can reach and clean complex surface geometries, dislodging particles from intricate shapes and hard-to-reach areas that static or linear cleaning mechanisms cannot access effectively.
3Reliability
If scheduled cleaning downtime is implemented, then chamber decontamination can occur, but production yield is reduced
Solution Approach 1:
The cleaning device incorporates sensors that detect particle contamination levels and automatically trigger appropriate contamination removal mechanisms when thresholds are exceeded, enabling on-demand cleaning during or between production cycles without requiring scheduled downtime, thus maintaining chamber cleanliness while maximizing productivity.
Solution Approach 2:
The integrated sensor system continuously monitors chamber cleanliness and provides feedback to the control system, which selectively activates specific contamination removal mechanisms based on real-time contamination levels and types, optimizing cleaning timing and method to minimize impact on production yield.
4Reliability
If multiple contamination removal mechanisms are integrated, then cleaning effectiveness is improved, but device complexity increases
Solution Approach 1:
The device employs a selection mechanism that dynamically activates only the specific contamination removal mechanism needed for the current contamination scenario, rather than running all mechanisms simultaneously. This dynamic selection approach maintains high cleaning effectiveness while reducing operational complexity and resource consumption.
Solution Approach 2:
Multiple contamination removal mechanisms are integrated into a single multi-functional device with a unified selection and control system. This consolidation allows the system to handle diverse contamination types (particulate, organic, inorganic) with different mechanisms while presenting a single operational interface, effectively managing complexity through functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enhances chamber uptime by efficiently removing all types of particles, including those adhered by electrostatic forces, and cleaning hard-to-reach areas, thereby reducing downtime and increasing production yield.
Implementation Method 1
A first section of the nozzle may be coupled to the vacuum channel. A second section of the nozzle may be coupled to a first contamination removal mechanism. A third section of the nozzle may be coupled to a second contamination removal mechanism.
Implementation Method 2
The device enhances chamber uptime by efficiently removing all types of particles, including those adhered by electrostatic forces
Implementation Method 3
A cleaning device with multiple contamination removal mechanisms, including a CO2 snow dispenser, ionizer, and ultrasonic gas dispenser
Implementation Method 4
A vacuum channel may extend through the body from the nozzle to the second end
Data Source
AI summary
Technologies related to maintaining and cleaning semiconductor processing chamber components and tools are described. A cleaning device may have a first end forming a nozzle and a second end configured to coupled to a particle counter. A first section of the nozzle is attached to a vacuum. A second section of the nozzle is attached to a first contamination removal mechanism of a plurality of contamination removal mechanisms. A third section of the nozzle is attached to a second contamination removal mechanism of the plurality of contamination removal mechanisms. A selection mechanisms selectively enables one or more of the plurality of contamination removal mechanisms.