Semiconductor Chamber Component By-Product Removal
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Solution Overview
Problem
The fabrication of semiconductor integrated circuits is hindered by particle contamination from by-products formed on chamber components, leading to increased costs and time due to frequent component replacement, as initial porosity and micro-cracking in these components allow process gases and cleaning compounds to react, generating more cracks and contamination.
Innovation Solution
A method involving heating chamber components to a predetermined temperature to transform nitride-containing by-products into oxide-containing or oxynitride-containing products, followed by using an acid solution, typically including HF and HNO3, to remove these products, thereby reducing particle contamination and extending the life of chamber components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chamber components are frequently replaced to remove by-products, then particle contamination is reduced, but manufacturing costs and downtime increase
Solution Approach 1:
The patent replaces the mechanical action of physical component replacement with a chemical/thermal cleaning process. By applying heat and chemical treatments to transform and remove by-products in-situ, the system eliminates the need for disassembly and replacement operations, thereby reducing downtime while maintaining contamination control
Solution Approach 2:
The patent introduces chemical agents (cleaning compounds) and thermal energy as intermediaries to facilitate by-product removal. These intermediaries enable the transformation of adhered by-products into removable forms without direct mechanical contact, allowing cleaning to occur while components remain installed in the chamber
2Reliability
If chamber components are frequently replaced to remove by-products, then particle contamination is reduced, but manufacturing costs increase
Solution Approach 1:
The patent enables recovery and reuse of chamber components that would otherwise be discarded or replaced. By implementing an effective in-situ cleaning process that removes by-products and restores components to acceptable condition, the system extends component service life and recovers valuable equipment assets
Solution Approach 2:
The patent replaces the expensive mechanical replacement operation with a lower-cost chemical/thermal cleaning process. This substitution eliminates costs associated with purchasing new components, disposal of old components, and the labor overhead of replacement operations
3Ease of manufacture
If initial porosity and micro-cracking are present in chamber components, then component manufacturing is simplified, but by-product formation and particle contamination increase
Solution Approach 1:
The patent converts the harmful effect of porosity and micro-cracking (which generate by-products) into a beneficial cleaning opportunity. The cleaning process specifically targets and removes by-products that form in these defect regions, transforming the previously harmful defect into a treatable condition that can be corrected through the cleaning cycle
Solution Approach 2:
The cleaning process enables chamber components to self-clean by removing their own by-products through the applied thermal and chemical treatment. The component undergoes transformation and cleaning in-situ without requiring external intervention or removal from the chamber
4Ease of manufacture
If initial porosity and micro-cracking are present in chamber components, then component manufacturing is simplified, but particle contamination increases
Solution Approach 1:
The patent converts the harmful effect of porosity and micro-cracking (which generate by-products) into a beneficial cleaning opportunity. The cleaning process specifically targets and removes by-products that form in these defect regions, transforming the previously harmful defect into a treatable condition that can be corrected through the cleaning cycle
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces particle contamination on semiconductor substrates, prolongs the useful life of chamber components, and improves the efficiency of semiconductor processing by removing defects and particles, thus enhancing the cleanliness and reliability of semiconductor manufacturing.
Implementation Method 1
heating the component to a predetermined temperature for a predetermined duration, wherein the nitride-containing by-product is transformed into an oxide-containing or oxynitride-containing product by the heating
Implementation Method 2
removing the oxide-containing or oxynitride-containing product with an acid solution
Data Source
AI summary
A method of removing a nitride-containing by-product from a component of a semiconductor apparatus includes heating the component to a predetermined temperature for a predetermined duration, wherein the nitride-containing by-product is transformed into an oxide-containing or oxynitride-containing product by the heating; and removing the oxide-containing or oxynitride-containing product with an acid solution. Another method of removing a by-product from a component of a semiconductor apparatus includes heating the component to a predetermined temperature; cooling the component from the predetermined temperature to a room temperature; rinsing the component with an acid solution including and HNO3 after the component is cooled; and washing the by-product and the acid solution off the component.