Factory Interface Chamber Filter Purge for Moisture Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic device manufacturing systems face issues with high humidity, oxygen levels, and chemical contaminants during substrate transfer, leading to contamination of chamber filters when access doors are open for servicing, which disrupts environmental control and affects substrate quality.
Innovation Solution
A factory interface apparatus with an environmental control system that supplies a purge gas and a filter purge apparatus to minimize moisture contamination of the chamber filter by providing a flushing gas when the access door is open, ensuring controlled environmental conditions and filter protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the access door is opened for personnel servicing, then ease of operation is improved, but moisture contamination of the chamber filter increases
Solution Approach 1:
A purge gas system acts as an intermediary between the ambient environment and the chamber filter. When the access door is opened, purge gas flows through the chamber to prevent moisture-laden ambient air from directly contacting the chamber filter, thus protecting it while allowing personnel access.
Solution Approach 2:
The system maintains an inert atmosphere within the factory interface chamber using purge gas (typically nitrogen). This inert environment prevents moisture contamination of the chamber filter even when the access door is open, as the inert gas displaces humid ambient air from contacting sensitive components.
2Manufacturing precision
If purge gas is supplied to control environmental conditions, then substrate quality is improved, but device complexity increases
Solution Approach 1:
The purge gas system serves multiple functions simultaneously: it controls environmental conditions (humidity, oxygen levels), protects the chamber filter from contamination, and maintains substrate quality. This multi-functionality reduces the need for separate systems for each purpose.
Solution Approach 2:
The system controls environmental parameters (temperature, humidity, oxygen concentration) by adjusting purge gas flow rates and composition. By dynamically changing these parameters, the system maintains optimal substrate quality without requiring complex mechanical interventions.
3Reliability
If the chamber filter is protected during servicing, then reliability is improved, but productivity decreases due to additional purge gas supply
Solution Approach 1:
The purge gas system is activated in advance before personnel servicing begins and continues during the entire servicing period. This preliminary and continuous action ensures the chamber filter is protected from the moment exposure to ambient air could occur, preventing contamination without requiring post-servicing cleanup or validation.
Solution Approach 2:
The purge gas flows continuously throughout the servicing interval, maintaining constant protection of the chamber filter. This continuous action eliminates gaps where contamination could occur, ensuring reliability without requiring intermittent monitoring or multiple separate protective measures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains controlled environmental conditions within the factory interface chamber, reduces filter contamination, and allows for rapid resumption of substrate processing by maintaining a dry and clean environment, even during servicing intervals.
Implementation Method 1
a chamber filter configured to filter the purge gas provided to factory interface chamber
Implementation Method 2
a filter purge apparatus configured to supply a flushing gas to the chamber filter when the access door is open in order to minimize moisture contamination of the chamber filter by ambient air
Implementation Method 3
an environmental control system coupled to the factory interface chamber and configured to supply a purge gas to control one or more environmental conditions within the factory interface chamber during substrate transfer through the factory interface chamber
Data Source
AI summary
A system includes a filter purge apparatus configured to supply a flushing gas to a portion of a factory interface chamber located upstream of a chamber filter to minimize moisture contamination of the chamber filter by ambient air. The filter purge apparatus is configured to supply the flushing gas in association with breach of the factory interface chamber which compromises controlled environment of the factory interface chamber.


