Chamber Gas Flow Path Layout for Uniform Substrate Cleaning
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in evenly distributing cleaning gases within the chamber, leading to cleaning defects where impurities remain in corners or regions other than corners.
Innovation Solution
The substrate processing apparatus includes a gas flow-controlling unit installed on the chamber's side wall, which features a flow path overlapping the edge frame. This unit ensures even gas distribution by allowing the cleaning gas to pass through the flow path and reach all areas of the chamber, including corners and central regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cleaning gas is sprayed into the chamber, then the chamber is cleaned, but the gas does not distribute evenly and corners remain contaminated
Solution Approach 1:
The gas flow controlling unit is divided into multiple segments including a body portion and multiple protrusion members. Each protrusion member creates separate flow paths that segment the gas flow into multiple streams, directing gas toward different areas of the chamber including corners, thereby improving uniformity of gas distribution while maintaining cleaning effectiveness
Solution Approach 2:
The protrusion members are strategically positioned at specific locations on the gas flow controlling unit to create localized flow control. This local quality modification ensures that gas flow is directed toward specific areas that would otherwise be poorly reached, such as corners and regions away from the spray source, achieving uniform cleaning across the entire chamber
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents uneven gas flow, ensuring that cleaning gases reach all areas of the chamber, thereby preventing cleaning defects and ensuring thorough removal of impurities.
Implementation Method 1
a flow path which is provided in a region overlapping the edge frame
Data Source
AI summary
A substrate processing apparatus includes a chamber, a substrate support positioned inside the chamber and supporting a substrate, an edge frame disposed above the substrate support and extending outward from an edge of the substrate support, and a gas flow-controlling unit installed on a side wall of the chamber to be positioned between the side wall of the chamber and a side surface of the substrate support along a periphery of the substrate support. The gas flow-controlling unit includes a flow path provided in a region overlapping the edge frame. Thus, the gas may be prevented from flowing unevenly to the corners or regions other than the corners within the chamber. That is, the gas may be evenly distributed in the circumferential direction of the chamber. Accordingly, the cleaning defect may be prevented from occurring at the corners of the chamber and in regions other than the corners.