Semiconductor Chamber Heating Layout for Stable Substrate Temperature
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Solution Overview
Problem
Existing substrate temperature control methods during semiconductor device fabrication face challenges in accuracy due to limitations in pyrometer and thermocouple measurements, such as interference from environmental radiation and lag in temperature response, which can lead to temperature overshoot and instability during material layer deposition.
Innovation Solution
A chamber arrangement with a combination of pyrometers and thermocouples, where pyrometers provide optical temperature measurements for the upper heater element array and thermocouples offer tactile temperature measurements for the lower heater element array, allowing independent control of heat output to improve temperature precision and stability, with additional configurations using multiple pyrometers and static thermocouples to enhance temperature uniformity and gradient control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a pyrometer is used to measure substrate temperature, then temperature measurement can be performed without physical contact, but electromagnetic radiation from other structures interferes with measurement accuracy
Solution Approach 1:
The heater system is segmented into multiple independent heater elements (first heater element, second heater element, third heater element) positioned at different locations. Each heater element can be independently controlled and monitored, allowing the system to address temperature measurement interference by isolating radiation sources from the pyrometer's line of sight to the substrate.
2Reliability
If a thermocouple is used to measure temperature, then reliable temperature feedback is obtained, but response to temperature change lags causing temperature overshoot
Solution Approach 1:
The system applies preliminary action by using multiple heater elements positioned to provide distributed heating before the substrate reaches critical temperature points. The independent control of each heater element allows proactive temperature management, reducing the need for aggressive corrective heating that would cause overshoot when thermocouple feedback arrives.
Solution Approach 2:
The system implements dynamic control by independently adjusting the power supplied to each heater element based on real-time temperature measurements. The controller can dynamically redistribute heating load among heater elements, optimizing the thermal response characteristics and reducing lag effects while maintaining reliable temperature feedback.
3Manufacturing precision
If multiple heater elements are used to control substrate temperature, then temperature distribution can be improved, but crosstalk between heater element arrays reduces control precision
Solution Approach 1:
The heater system is divided into multiple independently controllable heater elements positioned at different locations around the substrate. This segmentation allows the controller to address temperature non-uniformities by selectively adjusting individual heater elements without causing crosstalk, as each element's thermal influence zone is spatially separated.
Solution Approach 2:
Each heater element is controlled independently with tailored power levels based on local temperature requirements. The system applies local quality by allowing different regions of the substrate to receive customized heating, improving overall temperature uniformity while eliminating crosstalk through localized control rather than global adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances substrate temperature control by reducing crosstalk between heater element arrays, stabilizing temperature more quickly and accurately, and enabling adaptive power bias control, thus improving the consistency and quality of material layer deposition.
Implementation Method 1
Pyrometers can be employed to remotely provide temperature of a target using electromagnetic radiation emitted by the target in real-time
Implementation Method 2
The metal elements are generally formed from two different metals selected to generate a voltage corresponding to temperature at the thermocouple junction
Implementation Method 3
heater elements may generate heat according to electrical power applied to each of heater elements
Data Source
AI summary
A chamber arrangement has a chamber body with upper and lower walls. A substrate support is arranged within an interior of the chamber body and supported for rotation about a rotation axis. An upper heater element array is supported above the upper wall and a lower heater element array supported below the lower wall. A pyrometer is supported above the upper heater element array, is optically coupled to the interior of the chamber body, and is operably connected to the upper heater element array. A thermocouple is arranged within the interior of the chamber body, is in intimate mechanical contact with the substrate support, and is operably connected to the lower heater element array. Semiconductor processing systems and material layer deposition methods are also described.