Chamber Injector Cooling for CVD Precursor Decomposition
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Solution Overview
Problem
Hot surfaces within CVD process chambers cause premature decomposition of precursors, leading to undesirable deposition on chamber components, clogging, and stress-induced delamination, which impede gas flow and generate particles in the processing volume.
Innovation Solution
A gas injection apparatus with active cooling and separation features, where a coolant is flowed through channels surrounding conduits to prevent thermal decomposition of gases, and the injector body is designed with arcuate surfaces and outlets to manage gas flow and reduce thermal energy influence, using additive manufacturing for intricate conduit and channel formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If precursors are delivered through heated channels to the processing volume, then gas flow delivery is achieved, but thermal decomposition of precursors occurs causing deposition on chamber components
Solution Approach 1:
The gas delivery system is segmented into multiple separate conduits within the injector body, each conduit isolated from others and from the chamber walls. This segmentation prevents thermal decomposition by ensuring precursors travel through dedicated, thermally isolated pathways rather than a shared heated channel.
Solution Approach 2:
The injector body acts as an intermediary component between the gas source and the processing volume. It provides a transition zone where precursors can be delivered without direct exposure to chamber heating, mediating the thermal environment to prevent premature decomposition while maintaining delivery efficiency.
2Productivity
If precursors flow through heated channels, then delivery to processing volume is maintained, but clogging of flow path occurs
Solution Approach 1:
Multiple separate conduits within the injector body provide redundant, isolated flow paths. If one conduit experiences partial clogging or decomposition, others remain functional, maintaining overall flow reliability and preventing complete flow path blockage.
Solution Approach 2:
The system changes the thermal parameters of the conduit environment by providing thermally isolated pathways with controlled temperature profiles. This parameter change prevents the excessive heating that causes precursor decomposition and subsequent clogging, while maintaining sufficient temperature for proper gas delivery.
3Productivity
If deposition occurs on chamber components, then precursor delivery continues, but stress and CTE induced delamination occurs generating particles
Solution Approach 1:
The injector body serves as a protective intermediary that prevents direct thermal exposure of precursors to chamber components. By mediating the thermal transition, it eliminates the root cause of deposition-related delamination and particle generation while maintaining effective precursor delivery to the processing volume.
Solution Approach 2:
The harmful thermal decomposition process is extracted from the chamber environment by providing separate, thermally isolated conduits. This removes the source of deposition that leads to delamination and particle generation, preventing the harmful chain reaction while preserving gas delivery functionality.
4Reliability
If active cooling channels are added to prevent thermal decomposition, then thermal control is improved, but device complexity increases
Solution Approach 1:
The cooling channels are merged with the conduit structure, forming an integrated injector body where cooling passages are incorporated into the walls of the gas delivery conduits. This merging provides effective thermal control while minimizing the number of separate components and reducing overall device complexity.
Solution Approach 2:
The injector body structure serves multiple functions simultaneously: it provides structural support, contains the gas delivery conduits, incorporates cooling channels for thermal control, and prevents thermal decomposition. This multi-functionality reduces the need for separate dedicated components, thereby reducing device complexity while maintaining reliable thermal control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents thermal decomposition of gases, maintains flow integrity, and reduces particle generation by insulating and cooling precursor gases before they enter the process volume, ensuring consistent and reliable gas delivery.
Implementation Method 1
A coolant is flowed through channels surrounding conduits to prevent thermal decomposition of gases
Implementation Method 2
insulating and cooling precursor gases before they enter the process volume
Data Source
AI summary
Embodiments described herein generally relate to apparatus for fabricating semiconductor devices. A gas injection apparatus is coupled to a first gas source and a second gas source. Gases from the first gas source and second gas source may remain separated until the gases enter a process volume in a process chamber. A coolant is flowed through a channel in the gas injection apparatus to cool the first gas and the second gas in the gas injection apparatus. The coolant functions to prevent thermal decomposition of the gases by mitigating the influence of thermal radiation from the process chamber. In one embodiment, the channel surrounds a first conduit with the first gas and a second conduit with the second gas.