Chamber Insert Slit and Holes for Uniform Deposition
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Solution Overview
Problem
Conventional semiconductor processing chamber inserts disrupt gas flow and make it difficult to maintain stable, low inner pressure, leading to non-uniform deposition of thin layers on substrates due to the presence of inner and outer shields, which are often removed to stabilize pressure but increase the distance between the chamber insert and the stage, requiring more purge gas and reducing deposition rate and uniformity.
Innovation Solution
A chamber insert with a cylindrical body having an open top and bottom, a slit, and multiple holes positioned circumferentially, which reduces turbulence and maintains stable gas flow by allowing source gas discharge through both the slit and holes, minimizing pressure gradients and reducing the amount of purge gas needed, thereby maintaining a uniform flow and lower vacuum levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inner and outer shields are present in the chamber insert, then uniformity of thin layer deposition is improved, but inner pressure stability deteriorates
Solution Approach 1:
The chamber insert is segmented into multiple functional components: a cylindrical body, inner shield, outer shield, and pumping plate. Each component serves a specific purpose in managing gas flow and pressure while contributing to overall deposition uniformity. The segmentation allows independent optimization of each component's function.
Solution Approach 2:
The chamber insert employs a nested structure where the inner shield is positioned inside the cylindrical body, and the outer shield surrounds the inner shield. This nested arrangement allows multiple shields to work together in a compact configuration, maintaining uniformity while managing pressure through coordinated gas flow control at different radial levels.
2Stability of the object's composition
If inner and outer shields are removed to stabilize inner pressure, then inner pressure stability is improved, but distance between chamber insert and stage increases, requiring more purge gas
Solution Approach 1:
The pumping plate acts as an intermediary component between the shields and the stage. It provides a surface for pressure stabilization while the shields maintain their positioning function. This intermediary structure allows pressure control without requiring the shields to be removed, thereby reducing purge gas requirements compared to shield-less designs.
3Object-affected harmful factors
If greater amount of purge gas is supplied, then source gas deposition on stage lower portion is reduced, but uniformity of thin layer and deposition rate deteriorate
Solution Approach 1:
The chamber insert implements local quality control through strategically positioned shields at different radial locations. The inner and outer shields create localized gas flow management zones that prevent source gas from reaching the stage lower portion without requiring high overall purge gas flow rates. This localized control preserves deposition uniformity while protecting against harmful deposits.
4Object-affected harmful factors
If greater amount of purge gas is supplied, then source gas deposition on stage is reduced, but deposition rate decreases
Solution Approach 1:
The multi-shield configuration creates localized protection zones that selectively block source gas from reaching the stage while allowing deposition to proceed efficiently on the substrate. This local control mechanism reduces the need for high overall purge gas flow rates, thereby maintaining higher deposition rates compared to uniform purge gas distribution approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a stable and uniform gas flow, reducing the deposition of source gas on the chamber's lower portion, improving deposition rates and uniformity of thin layers on substrates while achieving a lower and more stable vacuum degree in the processing chamber.
Implementation Method 1
A chamber insert with a cylindrical body having an open top and bottom, a slit, and multiple holes positioned circumferentially, which reduces turbulence and maintains stable gas flow by allowing source gas discharge through both the slit and holes
Implementation Method 2
minimizing pressure gradients and reducing the amount of purge gas needed, thereby maintaining a uniform flow and lower vacuum levels
Data Source
AI summary
Disclosed are chamber inserts and apparatuses using the chamber inserts. A chamber insert may include a cylindrical body portion including a top end portion and a bottom end portion, a first protruding portion extending outwardly from a first portion of the cylindrical body portion, the first portion positioned circumferentially along the cylindrical body portion and a second protruding portion extending outwardly from a second portion of the cylindrical body portion, the second portion positioned circumferentially along less than all of the cylindrical body portion. In another example, the chamber insert may include a cylindrical body portion including a top end portion and a bottom end portion, the cylindrical body portion including a slit and at least one hole, the slit and the at least one hole positioned circumferentially along the cylindrical body portion and a first protruding portion extending outwardly from a first portion of the cylindrical body portion.