Chamber Kit for In-Situ Temperature Sensor Calibration

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Solution Overview

Problem

In semiconductor manufacturing, temperature sensor calibration in thermal process chambers is hindered by sensor drift due to aging components and interference, requiring time-consuming and difficult methods that involve opening the process chamber, leading to inaccuracies and increased downtime.

Innovation Solution

A chamber kit and method using a plate with transparent material and calibration substrates of different materials, where energy is irradiated and reflected to determine actual and measured temperatures, allowing for in-situ calibration of temperature sensors without chamber opening, accounting for component aging and interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional calibration methods are used, then temperature sensors can be calibrated, but the process chamber must be opened and machine downtime increases

Engineering Contradiction:
Improvetemperature sensor calibration accuracyVSAvoidmachine downtime
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-positioning calibration substrates within the process chamber before the actual calibration procedure. The substrates are placed on the substrate support in advance, allowing the calibration to be performed in-situ during normal operation without requiring chamber opening or machine downtime. This enables the calibration action to be prepared beforehand and executed seamlessly during production.

Inventive Principle:
Principle #10Preliminary action

2Measurement precision

If multiple temperature sensors at different locations are calibrated, then comprehensive sensor coverage is achieved, but the calibration process becomes difficult and time-consuming

Engineering Contradiction:
Improvetemperature sensor calibration accuracyVSAvoidcalibration process complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies universality by designing calibration substrates that can be used for calibrating multiple temperature sensors at different locations within the process chamber. The same type of calibration substrate (with known reflectivity properties) can be positioned at various locations and used to calibrate temperature sensors throughout the chamber, eliminating the need for location-specific calibration equipment and simplifying the overall calibration process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If temperature sensors are used to monitor substrate temperature, then deposition uniformity can be controlled, but sensor drift due to component aging affects measurement accuracy

Engineering Contradiction:
Improvedeposition uniformityVSAvoidtemperature measurement accuracy
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies feedback by implementing a calibration mechanism that periodically measures the actual temperature using calibration substrates with known reflectivity properties and compares it against the sensor readings. This feedback loop allows the system to detect and correct sensor drift caused by component aging, maintaining accurate temperature measurements and consistent deposition uniformity over time without requiring manual intervention or chamber opening.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables accurate and efficient calibration of temperature sensors, reducing downtime, improving deposition uniformity, and extending component lifespan while accounting for radiation interference and component drift.

Implementation Method 1

determining one or more actual temperatures using energy reflected off of one of the first calibration substrate or the second calibration substrate

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

heating a substrate support positioned in a process chamber

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 3

one or more heat sources configured to heat the internal volume

Methodology Applied
Scientific EffectThermal Radiation: Thermal Radiation

Data Source

PatentUS20250003806A1Chamber kits, systems, and methods for calibrating temperature sensors for semiconductor manufacturing
Publication Date: 2025.01.02 APPLIED MATERIALS INC
  • US20250003806A1 patent drawing
  • US20250003806A1 patent drawing
  • US20250003806A1 patent drawing

AI summary

The present disclosure relates to chamber kits, systems, and methods for calibrating temperature sensors for semiconductor manufacturing. In one or more embodiments, a chamber kit for processing chambers applicable for semiconductor manufacturing includes a plate formed of a transparent material. The plate includes an opening formed in an outer face of the plate. The chamber kit includes a first calibration substrate positioned at least partially in the opening of the plate, and the first calibration substrate is formed of a first material. The chamber kit includes a second calibration substrate positioned at least partially in the opening of the plate, and the second calibration substrate is formed of a second material that is different than the first material.