Process Chamber Lid Coating for Plasma Erosion and Diffusion Control

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Solution Overview

Problem

Semiconductor process chamber components face defects due to harsh processing conditions, with existing protective coatings often resulting in abnormally large crystal grains that increase surface roughness and allow chemical diffusion, leading to erosion and corrosion.

Innovation Solution

A plasma-resistant protective coating comprising a stack of alternating layers of crystalline rare-earth oxide and crystalline or amorphous metal oxide layers, deposited using atomic layer deposition (ALD) or chemical vapor deposition (CVD), where the metal oxide layers inhibit grain growth in yttrium oxide layers, providing a conformal and dense barrier.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If protective coatings are deposited using thermal spray, sputtering, ion assisted deposition, plasma spray, or evaporation techniques, then the coating provides protection against harsh processing conditions, but the coating develops abnormally large crystal grains that increase surface roughness and create diffusion pathways

Engineering Contradiction:
Improveprotection against erosion and corrosionVSAvoidsurface roughness and grain size control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The coating is segmented into multiple thin alternating layers of rare-earth oxide (500-5000 Å) and metal oxide (1-500 Å) deposited by ALD, replacing single-layer thick coatings from conventional methods. This segmentation prevents abnormal grain growth while maintaining protective function

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The deposition method is changed from conventional thermal spray/sputtering to atomic layer deposition (ALD), and the coating thickness is reduced from micrometers to nanometers (500-5000 Å for rare-earth oxide, 1-500 Å for metal oxide). These parameter changes enable conformal coverage and fine grain structure while maintaining protection

Inventive Principle:
Principle #35Parameter changes

2Reliability

If abnormally large crystal grains form in the protective coating, then the coating may provide adequate protection, but the large grains increase surface roughness and create pathways for chemical diffusion through cracks and grain boundaries

Engineering Contradiction:
Improvecoating protectionVSAvoidchemical diffusion through grain boundaries
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The coating is divided into multiple thin alternating layers of rare-earth oxide (500-5000 Å) and metal oxide (1-500 Å) deposited by ALD, replacing single-layer thick coatings from conventional methods. This segmentation prevents abnormal grain growth while maintaining protective function

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The metal oxide layer acts as an intermediary barrier between rare-earth oxide layers, inhibiting grain growth and blocking diffusion pathways. The alternating structure creates multiple interfaces that prevent continuous diffusion paths

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If a dense conformal barrier is created to prevent chemical diffusion, then protection against corrosion improves, but the coating structure becomes more complex with multiple alternating layers

Engineering Contradiction:
Improveresistance to chemical diffusionVSAvoidcoating structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The deposition method is changed from conventional thermal spray/sputtering to atomic layer deposition (ALD), and the coating thickness is reduced from micrometers to nanometers (500-5000 Å for rare-earth oxide, 1-500 Å for metal oxide). These parameter changes enable conformal coverage and fine grain structure while maintaining protection

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The coating uses composite alternating layers of rare-earth oxide and metal oxide, where each layer thickness is precisely controlled (500-5000 Å and 1-500 Å respectively). This composite structure achieves superior diffusion barrier properties through nanoscale layering

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The coating effectively controls grain growth, reduces surface roughness, and prevents chemical diffusion, enhancing the durability and longevity of chamber components by creating a robust, porosity-free barrier against corrosive plasmas and chemicals.

Implementation Method 1

The crystalline or amorphous metal oxide layers may inhibit grain growth in the crystalline yttrium oxide layers

Methodology Applied
Scientific EffectGrain growth inhibition:

Implementation Method 2

The crystalline or amorphous metal oxide layers may inhibit grain growth in the crystalline yttrium oxide layers... providing a conformal and dense barrier

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Implementation Method 3

Abnormally large crystal grains may increase the protective coating's surface roughness... The crystalline or amorphous metal oxide layers may inhibit grain growth in the crystalline yttrium oxide layers

Methodology Applied
Scientific EffectSurface roughness reduction:

Data Source

PatentUS12049696B2Plasma resistant process chamber lid
Publication Date: 2024.07.30 APPLIED MATERIALS INC
  • US12049696B2 patent drawing
  • US12049696B2 patent drawing
  • US12049696B2 patent drawing

AI summary

A lid or other chamber component for a process chamber comprises a) at least one surface comprising a first ceramic material, wherein the first ceramic material comprises Y3Al5O12 and b) an internal region beneath the at least one surface comprising a second ceramic material, wherein the second ceramic material comprises a combination of Al2O3 and ZrO2.