Processing Chamber Pressure Control to Prevent Condensation Etching
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in uniformly removing deposited films during cleaning processing due to temperature variations and pressure fluctuations, leading to etching unevenness and potential damage to processing container components.
Innovation Solution
A processing apparatus equipped with a temperature sensor, gas supply unit, pressure regulation unit, and control unit that utilizes a vapor pressure curve to set a target pressure below the vapor pressure of water, ensuring the pressure in the processing container remains below the vapor-liquid equilibrium point, preventing water condensation and promoting uniform etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pressure is increased to enhance etching rate, then cleaning efficiency is improved, but water condensation occurs causing etching unevenness
Solution Approach 1:
The patent dynamically adjusts pressure parameters based on temperature measurements. By referencing a vapor pressure curve that correlates temperature with water vapor pressure, the system determines an optimal pressure setting that prevents condensation while maintaining effective etching. This parameter change approach resolves the contradiction by adapting pressure to temperature conditions rather than using fixed pressure settings.
Solution Approach 2:
The system implements a feedback mechanism where temperature sensors continuously monitor the processing container, and the control unit uses this information to adjust pressure in real-time. The feedback loop ensures that pressure remains below the vapor pressure threshold identified from the vapor pressure curve, preventing water condensation while maintaining cleaning efficiency through optimized pressure control.
2Productivity
If temperature is increased to improve etching rate, then cleaning efficiency is improved, but pressure control becomes more difficult to prevent condensation
Solution Approach 1:
The patent applies preliminary action by pre-establishing a vapor pressure curve that defines the relationship between temperature and water vapor pressure. This curve is stored in the control unit and used to determine target pressure settings before actual processing occurs. By having this reference data prepared in advance, the system simplifies real-time pressure control while maintaining the ability to prevent condensation across varying temperature conditions.
3Ease of operation
If fixed pressure control is used, then device operation is simple, but etching unevenness occurs due to temperature variations
Solution Approach 1:
The patent transitions from static fixed pressure control to dynamic pressure control that adapts to temperature variations. The control unit continuously adjusts pressure settings based on real-time temperature measurements and the vapor pressure curve. This dynamic approach maintains etching uniformity across different temperature conditions while preserving operational simplicity through automated control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes the cleaning process, suppresses etching unevenness, and maintains the efficiency of film removal, preventing damage to the processing container components by maintaining water vapor state and ensuring uniform etching rates across different temperatures.
Implementation Method 1
a temperature sensor that detects a temperature in the processing container
Implementation Method 2
a vapor pressure curve in which the temperature in the processing container is associated with a vapor pressure of water in the processing container
Implementation Method 3
the processing apparatus etches (removes) the deposited film by supplying a cleaning gas into the processing container
Data Source
AI summary
A processing apparatus includes: a processing container; a temperature sensor that detects a temperature therein; a gas supply unit that supplies a cleaning gas into the processing container; a pressure regulation unit that regulates a pressure in the processing container; and a control unit that controls the gas supply unit and the pressure regulation unit to perform a cleaning processing of removing a deposited film in the processing container. The control unit stores a vapor pressure curve in which the temperature in the processing container is associated with a vapor pressure of water in the processing container. In the cleaning processing, the control unit sets a target pressure below the vapor pressure curve based on the temperature detected by the temperature sensor and the vapor pressure curve, and controls the pressure regulation unit such that the pressure in the processing container becomes the target pressure.