Processing Chamber Reactant Sensing for Precise Cleaning Endpoints
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Solution Overview
Problem
Current monitoring systems for semiconductor processing chambers lack real-time and accurate monitoring of reactant amounts and cleaning processes, leading to inefficiencies and potential damage from excessive cleaning, and are affected by plasma interference, reducing reproducibility and increasing processing time.
Innovation Solution
A system with thin film-type sensors and a monitoring apparatus that measures reactant amounts using piezoelectric elements and wireless communication, determining the start and end points of the cleaning process without disrupting plasma, using threshold values set by gas type, component ratio, pressure, and power applied.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical sensors are used to monitor plasma process, then monitoring capability is provided, but accuracy is reduced due to plasma interference
Solution Approach 1:
The patent introduces a plasma-resistant sensor as an intermediary device that can operate within the plasma environment without being affected by it. This sensor acts as a mediator between the plasma process and the monitoring system, transmitting accurate process data without suffering from plasma interference that affects optical sensors.
Solution Approach 2:
The patent replaces optical sensing methods with a different sensing mechanism that is not based on light transmission. By using a sensor that operates on a different physical principle immune to plasma interference, the system eliminates the harmful effect of plasma on measurement accuracy.
2Measurement precision
If sensors are mounted inside processing chamber in bulk form, then monitoring capability is provided, but plasma uniformity is disrupted reducing reproducibility
Solution Approach 1:
The patent applies local quality by placing a single sensor at a specific location rather than multiple sensors throughout the chamber. This localized approach provides sufficient monitoring capability at the critical measurement point while minimizing disruption to the overall plasma uniformity and process reproducibility.
Solution Approach 2:
The patent extracts the monitoring function to a minimal essential component - a single sensor - rather than using multiple sensors. This extraction of the core monitoring capability reduces the sensor presence in the plasma environment, thereby maintaining plasma uniformity while still achieving the monitoring objective.
3Reliability
If cleaning process is performed excessively, then contamination is removed, but inner wall is damaged and processing time increases
Solution Approach 1:
The patent implements feedback control by using real-time sensor data to monitor the cleaning process progress. The sensor detects when the cleaning objective has been achieved, and this information feeds back to stop the cleaning process, preventing excessive cleaning that would damage the chamber inner wall and waste time.
Solution Approach 2:
The patent uses preliminary action by establishing predetermined criteria for cleaning completion based on sensor measurements. These pre-set thresholds guide the cleaning process to stop at the optimal point, avoiding both insufficient cleaning and excessive cleaning that would waste time and damage components.
4Loss of information
If real-time monitoring of reactant amounts is not implemented, then system complexity is reduced, but cleaning process impact cannot be confirmed
Solution Approach 1:
The patent introduces a plasma-resistant sensor as an intermediary that enables real-time monitoring of reactant amounts during the cleaning process. This sensor acts as a mediator between the plasma environment and the monitoring system, providing continuous process information without requiring complex monitoring infrastructure.
Solution Approach 2:
The patent replaces complex optical monitoring systems with a simpler sensor-based approach that directly measures reactant amounts. By using a different sensing mechanism that is immune to plasma interference, the system achieves real-time monitoring capability with reduced overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time monitoring of internal processing chamber conditions, reducing time loss and increasing productivity by accurately determining cleaning process endpoints, minimizing greenhouse gas usage, and maintaining process reproducibility.
Implementation Method 1
a piezoelectric element provided between the pair of electrodes; and a wireless communication module configured to transmit a measurement value measured by the sensing module to the monitoring apparatus
Data Source
AI summary
Proposed is a system for monitoring internal conditions of a processing chamber. The system includes at least one sensor provided inside the processing chamber and configured to measure an amount of reactant present inside the processing chamber, and a monitoring apparatus configured to monitor the internal conditions of the processing chamber on the basis of a measurement value received from the at least one sensor, wherein the monitoring apparatus determines at least one of a start point and an end point of a cleaning process for the processing chamber on the basis of a change in the measurement value.