Semiconductor Chamber Spacer and Pumping Liner for Laminar Flow
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Solution Overview
Problem
Conventional semiconductor processing chambers face issues with byproduct buildup on the pedestal underside and turbulent flow, leading to non-uniform substrate temperature and patterned material layers due to inefficient flow paths and component profiles.
Innovation Solution
The semiconductor processing chamber design includes a spacer with an arcuate profile and a pumping liner with apertures, creating a laminar flow path that minimizes turbulence and byproduct re-condensation, enhancing substrate uniformity and etch selectivity through optimized flow pathways and component configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional processing chamber designs are used, then the chamber structure is simple, but byproduct buildup occurs on the pedestal underside and turbulent flow creates non-uniform substrate temperature
Solution Approach 1:
The chamber lid is segmented into multiple functional components: a spacer defining a first region, a pumping liner defining a second region with pumping apertures, and a plenum region. This segmentation allows separate control of process gas flow and byproduct removal paths, preventing turbulent mixing that causes temperature non-uniformity while maintaining effective byproduct evacuation.
Solution Approach 2:
The plenum region acts as an intermediary chamber between the process region and the pumping system. It provides a dedicated space for byproduct collection and removal without directly interfering with the process gas flow over the substrate, thereby eliminating turbulent flow-induced temperature variations while maintaining efficient byproduct evacuation.
2Productivity
If turbulent flow is used for byproduct removal, then byproduct evacuation is effective, but additional byproduct buildup occurs and chamber cleaning frequency increases
Solution Approach 1:
The flow path is segmented into a laminar process region for substrate processing and a separate plenum region for byproduct collection. The pumping liner with its array of apertures creates a controlled, laminar flow pattern that efficiently evacuates byproducts without generating the turbulence that causes additional byproduct buildup on chamber surfaces.
Solution Approach 2:
The flow regime is changed from turbulent to laminar by redesigning the chamber lid structure. The spacer and pumping liner configuration, along with the plenum region, establishes smooth, laminar flow patterns that maintain effective byproduct removal while preventing the turbulent-induced byproduct deposition that would require frequent chamber cleaning.
3Manufacturing precision
If the pedestal is positioned closer to the showerhead for better process control, then process uniformity improves, but byproduct re-condensation on the pedestal increases
Solution Approach 1:
The plenum region serves as an intermediary space that captures byproducts before they can re-condense on the pedestal. Even when the pedestal is positioned close to the showerhead for optimal process uniformity, the plenum intercepts byproduct-laden flow and directs it through the pumping liner apertures for removal, preventing re-condensation on the pedestal surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces byproduct buildup, improves thermal uniformity, and increases etch selectivity, resulting in higher quality semiconductor devices with reduced chamber downtime for cleaning.
Implementation Method 1
creating a laminar flow path that minimizes turbulence and byproduct re-condensation
Data Source
AI summary
Exemplary semiconductor processing chambers may include showerhead. The chambers may include a pedestal configured to support a semiconductor substrate, where the showerhead and pedestal at least partially define a processing region within the semiconductor chamber. The chamber may include a spacer characterized by a first surface in contact with the showerhead and a second surface opposite the first surface. The chamber may include a pumping liner characterized by a first surface in contact with the spacer and a second surface opposite the first surface. The pumping liner may define a plurality of apertures within the first surface of the pumping liner.