Semiconductor Chamber Sticking Probability Control
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Solution Overview
Problem
The temperature of the chamber wall in semiconductor manufacturing devices does not accurately represent the sticking probability of particles, leading to unstable etching rates despite maintaining a predetermined temperature.
Innovation Solution
A semiconductor manufacturing device with a sensor to detect an index value indicating the chamber state, a sticking probability calculator, and a control section to adjust the sticking probability by varying parameters such as light irradiation, gas supply, or voltage application, ensuring the sticking probability is maintained at a predetermined value.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the temperature of the chamber wall is maintained at a predetermined temperature by feedback control, then the temperature stability is improved, but the etching rate cannot necessarily be maintained at a desired rate because the temperature does not accurately represent the sticking probability of particles
Solution Approach 1:
The invention transitions from controlling only temperature to controlling multiple parameters including sticking probability. The control section adjusts the sticking probability as an additional control parameter alongside temperature, recognizing that etching rate depends on both temperature and particle sticking characteristics. This multi-parameter control approach resolves the contradiction by adding degrees of freedom to the control system.
Solution Approach 2:
The invention implements a feedback control mechanism where the actual etching rate is measured and compared with the target etching rate. Based on this feedback, the control section adjusts the sticking probability to compensate for deviations in etching rate, even when temperature is held constant. This closed-loop feedback ensures that the etching rate is maintained at the desired level.
2Quantity of substance
If particles are deposited on the chamber wall changing its heat capacity, then the chamber wall state changes, but the temperature measurement becomes an inaccurate indicator of particle sticking probability
Solution Approach 1:
The invention introduces sticking probability as an intermediary parameter that directly reflects the state of particle deposition on the chamber wall. Instead of using temperature as a direct measure of sticking probability, the system uses sticking probability as an intermediate variable that is controlled to achieve the desired etching rate, decoupling the measurement accuracy from the physical changes in chamber wall heat capacity.
3Stability of the object's composition
If the sticking probability is controlled by adjusting multiple parameters such as light irradiation, gas supply, or voltage application, then the etching rate stability is improved, but the device complexity increases
Solution Approach 1:
The control section is designed as a multi-functional unit that can adjust multiple parameters (light irradiation amount, gas supply amount, voltage application amount) to control the sticking probability. This universal control approach allows a single control system to manage various aspects of the chamber environment, achieving etching rate stability without proportionally increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise control of the sticking probability, stabilizing the etching rate and improving the quality of semiconductor devices by effectively managing the chamber wall conditions.
Implementation Method 1
an index value calculating section configured to calculate the index value on a basis of the calculated particle density... the sensor detects the emission intensity in the direction of the line of sight
Implementation Method 2
a sticking probability calculating section configured to calculate a value of a sticking probability of particles sticking to a chamber wall of the chamber... an acting section capable of varying the sticking probability in the chamber
Data Source
AI summary
Disclosed herein is a semiconductor manufacturing device including, a chamber, a sensor, a sticking probability calculating section, an acting section, and a control section.