Chamber Component Surface Texturing for Film Uniformity
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Solution Overview
Problem
The deposition of materials on semiconductor substrates via CVD or ALD often results in non-uniformities, leading to additional costs for planarization and potential integrated circuit failures.
Innovation Solution
The method involves measuring parameters of a reference substrate or heated pedestal using sensors and modifying the surface of chamber components to achieve improved film uniformity, using techniques such as texturing tools to adjust the emissivity and surface roughness of chamber components within process chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional CVD or ALD deposition is used on semiconductor substrates, then material deposition is achieved, but non-uniformities in the deposited material occur
Solution Approach 1:
The chamber component surface is modified to have non-uniform properties - specifically, a non-uniform emissivity profile or textured surface structure - to compensate for non-uniformities in the deposition process. This local variation in surface properties creates a more uniform thermal and deposition environment across the substrate, resolving the contradiction between achieving deposition and maintaining uniformity.
Solution Approach 2:
The emissivity parameter of the chamber component surface is changed from uniform to non-uniform through texturing or coating. This parameter change alters the thermal radiation distribution within the chamber, thereby improving the uniformity of material deposition across the substrate while maintaining the deposition process itself.
2Manufacturing precision
If non-uniform deposition occurs, then additional planarization or repair steps are required, but this increases processing costs and time
Solution Approach 1:
The chamber component surface is pre-modified with a non-uniform emissivity profile or texture before the deposition process. This preliminary action prevents non-uniform deposition from occurring in the first place, eliminating the need for subsequent planarization or repair steps and thereby improving processing efficiency while maintaining film uniformity.
3Reliability
If uniform material deposition is achieved, then integrated circuit reliability improves, but this requires modified chamber components with non-uniform surfaces
Solution Approach 1:
Instead of mechanically precision-machining the chamber component surface to achieve uniformity, the invention uses surface texturing or emissivity modification techniques. This substitution of mechanical precision work with thermal/radiative field control simplifies the manufacturing of chamber components while achieving the desired uniform deposition and improved integrated circuit reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances film uniformity on substrates during processing by creating a thermally uniform environment, reducing non-uniform deposition patterns and improving the overall performance of semiconductor processing.
Implementation Method 1
modifying a surface of a chamber component based on the measured parameter... the surface has a region with an emissivity that increases continuously from one end of the region to an opposite end of the region
Implementation Method 2
measuring a parameter of a reference substrate or a heated pedestal
Data Source
AI summary
Methods and apparatus for surface profiling and texturing of chamber components for use in a process chamber, such surface-profiled or textured chamber components, and method of use of same are provided herein. In some embodiments, a method includes measuring a parameter of a reference substrate or a heated pedestal using one or more sensors and modifying a surface of a chamber component based on the measured parameter.