Semiconductor Chamber Isolation Window Fixing Structure

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Solution Overview

Problem

In semiconductor manufacturing, the quartz window in degas chambers is prone to breakage due to alternating pressure and temperature-induced deformation of the resin pad, leading to collisions with the chamber side wall and uneven force distribution.

Innovation Solution

A chamber design featuring an isolation window fixing structure with a first and second fixing part, connected via fasteners and washers, securely attaches the isolation window to the chamber body, preventing vertical and horizontal displacement and eliminating the need for a resin pad, thus preventing collisions and uneven force application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a resin pad is used to support the quartz window, then the window can be positioned and supported, but the resin pad deforms under alternating pressure and temperature, causing the window to collide with the chamber wall and break

Engineering Contradiction:
Improvequartz window stabilityVSAvoidquartz window strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the material parameter from soft resin pad to hard metal fixing structure, which maintains dimensional stability under pressure and temperature variations, preventing window deformation and collision

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The fixing structure is divided into multiple components including fixing plate, fixing ears, and connection bolts, allowing for precise positioning and secure attachment of the quartz window to the chamber wall

Inventive Principle:
Principle #1Segmentation

2Reliability

If a quartz window press ring is added to apply preload, then the window moving space is confined and collision is prevented, but the structure complexity increases and the resin pad still deforms under heat

Engineering Contradiction:
Improvequartz window protectionVSAvoidfixing device complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the support and fixing functions into an integrated metal fixing structure that replaces both the resin pad and press ring, achieving window stabilization while simplifying the overall device structure

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the resin pad component entirely, using only the metal fixing structure to provide both support and constraint functions, thereby removing the source of thermal deformation

Inventive Principle:
Principle #2Taking out (Extraction)

3Device complexity

If the quartz window is only supported by the resin pad without vertical fixation, then the structure is simple, but the window moves vertically under alternating pressure and collides with the chamber wall

Engineering Contradiction:
Improvefixing structure complexityVSAvoidquartz window stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent creates a dynamic fixing system where the metal fixing structure can accommodate thermal expansion and pressure variations while maintaining constant constraint on the quartz window, preventing collision during pressure cycles

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively secures the isolation window, preventing damage from pressure and temperature variations, ensuring the window's integrity and maintaining chamber tightness through balanced force distribution and heat dissipation.

Implementation Method 1

ensuring the window's integrity and maintaining chamber tightness through balanced force distribution

Methodology Applied
Scientific EffectForce distribution: Mechanical Force

Implementation Method 2

ensuring the window's integrity and maintaining chamber tightness through balanced force distribution and heat dissipation

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS10297477B2Chamber
Publication Date: 2019.05.21 BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
  • US10297477B2 patent drawing
  • US10297477B2 patent drawing
  • US10297477B2 patent drawing

AI summary

Embodiments of the invention provide a chamber for semiconductor processing, which includes a chamber body and an isolation window, the chamber body being of a tubby structure and having an upper end which is an open end, and the isolation window being arranged at the open end of the chamber body and used for sealing the chamber. The chamber further includes an isolation window fixing structure used for fixing the isolation window at the open end of the chamber body and a first fixing part and a second fixing part connected with each other, the first fixing part being fixedly connected with an edge area of an upper surface of the isolation window, and the second fixing part being fixedly connected with the chamber body.