Chamfer Cutting Reflective Layer for Display Panel Laser Processing
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Solution Overview
Problem
The high temperature generated during laser cutting of display panels for chamfer cuttings can cause the panels to become brittle, leading to cracks and collapses, and affects nearby circuit components, degrading display performance.
Innovation Solution
A chamfer cutting reflective layer with a reduced thickness in the direction perpendicular to the chamfer cutting line is applied on the display panel, effectively reflecting laser light away from the panel edges, preventing brittleness and damage, and reducing thermal diffraction impacts on circuit components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is performed at high temperature to form chamfer cuttings, then the chamfer cutting process can be completed, but the display panel becomes brittle and generates cracks and collapses
Solution Approach 1:
A reflective layer is introduced as an intermediary between the laser and the display panel. This reflective layer absorbs or reflects the laser energy, preventing direct thermal interaction between the laser and the display panel substrate, thereby avoiding brittleness and structural damage while enabling successful chamfer cutting
Solution Approach 2:
The reflective layer converts the harmful high-temperature laser energy into a beneficial controlled thermal process. By managing the laser energy interaction, the harmful thermal effect that causes brittleness is transformed into a controlled heating process that achieves the desired chamfer shape without damaging the panel
2Productivity
If high temperature laser cutting is used for chamfer formation, then the cutting process is effective, but thermal diffraction affects nearby circuit components and degrades display performance
Solution Approach 1:
The reflective layer serves as a thermal barrier and mediator, confining the laser-induced thermal field to the intended cutting zone. This prevents thermal diffraction from spreading to nearby circuit components, protecting them from thermal damage while maintaining effective chamfer cutting
Solution Approach 2:
The reflective layer enables localized thermal processing by confining the laser energy interaction to the specific chamfer region. This creates a localized high-temperature zone for effective cutting while keeping surrounding areas, including circuit components, at safe temperatures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution suppresses the formation of cracks and collapses at chamfer regions, maintains display panel integrity, and prevents degradation of display performance by reflecting excess laser energy, ensuring accurate and secure chamfer cutting.
Implementation Method 1
A chamfer cutting reflective layer is disposed on the display surface of the display panel and along an edge of the chamfer surface... effectively reflecting laser light away from the panel edges... reducing thermal diffraction impacts on circuit components
Data Source
AI summary
A display panel and a display panel fabrication method are provided. The display panel comprises a display region; and a peripheral circuit region surrounding the display region. The display panel has a display surface facing viewers and covering the display region and the peripheral circuit region. At least one corner of the display panel is provided with a chamfer having a chamfer surface, the chamfer surface is a new side surface which is going to be introduced to the display panel after the chamfer is formed. A chamfer cutting reflective layer is disposed on the display surface of the display panel and along an edge of the chamfer surface. In a direction perpendicular to a chamfer cutting line and towards the at least one corner of the display panel, a thickness of the chamfer cutting reflective layer is reduced.