Chamfered Camera Module Layout for Higher Screen-to-Body Ratio

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Solution Overview

Problem

The challenge of miniaturizing camera modules to achieve a full-screen design is hindered by the limitations of traditional lens holders and the need for safety distances, which prevent further reduction in size, thus obstructing the increase in screen-to-body ratio in electronic devices.

Innovation Solution

A camera module with a chamfered design that fits the corner of the electronic device, featuring a photosensitive assembly with a chamfered molded body and circuit board, allowing for a narrower top and side areas, and optical lens placement closer to the device edges, thereby increasing the screen-to-body ratio.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional lens holder design is used with COB process, then structural strength and reliability are ensured, but camera module size cannot be further reduced due to lens holder wall thickness limitations and safety distance requirements

Engineering Contradiction:
Improvecamera module sizeVSAvoidlens holder bearing strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent merges the lens holder and circuit board into a single integrated structure. The circuit board serves dual functions as both the electrical connection substrate and the mechanical support structure for the lens assembly, eliminating the separate lens holder component. This integration removes the need for additional wall thickness and safety distances that would be required for a separate lens holder, thereby reducing overall camera module size while maintaining structural strength through the unified circuit board design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit board is designed to perform multiple functions: electrical signal transmission, mechanical support for the lens assembly, and structural framing. By making the circuit board multi-functional, the patent eliminates the need for dedicated lens holder components, thereby reducing the camera module's overall size and component count while ensuring adequate bearing strength through the circuit board's reinforced structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Volume of moving object

If safety distances are reserved between lens holder and internal components (electronic components, gold wires, chips), then reliability is ensured, but camera module longitudinal size increases

Engineering Contradiction:
Improvecamera module longitudinal sizeVSAvoidsafety distance for component spacing
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

By integrating the lens holder function into the circuit board, the patent eliminates the need for separate safety distances between a dedicated lens holder and internal components. The circuit board's unified structure allows internal components to be mounted directly on its surface without requiring additional clearance zones, thereby reducing the camera module's longitudinal size while maintaining reliable electrical and mechanical connections.

Inventive Principle:
Principle #5Merging (Combining)

3Area of stationary object

If camera module is positioned closer to top edge of mobile phone, then screen-to-body ratio increases, but available space for camera components is reduced

Engineering Contradiction:
Improvescreen-to-body ratioVSAvoidcamera module size
Core Design Contradiction:
Area of stationary objectVSVolume of moving object

Solution Approach 1:

The patent integrates multiple camera components directly onto the circuit board, eliminating the need for a separate lens holder that would occupy additional space. This component integration significantly reduces the camera module's overall footprint, allowing it to be positioned closer to the top edge of the mobile phone and thereby increasing the screen-to-body ratio.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the structural parameters of the camera module by eliminating the lens holder wall thickness and reducing safety distance requirements through integration. This parameter optimization reduces the camera module's longitudinal and lateral dimensions, enabling closer placement to the phone's top edge and maximizing the display area.

Inventive Principle:
Principle #35Parameter changes

4Volume of moving object

If lens holder wall thickness is reduced to shrink camera module size, then camera module becomes smaller, but bearing strength is compromised

Engineering Contradiction:
Improvecamera module sizeVSAvoidlens holder wall thickness
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent eliminates the separate lens holder structure entirely by integrating its support function into the circuit board. Since the circuit board is a rigid, structurally optimized component designed for electrical and mechanical purposes, it provides adequate bearing strength for the lens assembly without requiring the additional wall thickness that a dedicated lens holder would need. This integration achieves size reduction while maintaining structural integrity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP3767936B1Photographing module having chamfer, light-sensing assembly, and electronic device
Publication Date: 2026.02.18 NINGBO SUNNY OPOTECH CO LTD
  • EP3767936B1 patent drawingFigure 1
  • EP3767936B1 patent drawingFigure 2
  • EP3767936B1 patent drawingFigure 3~4

AI summary

This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.