Chamfered Disk Edge Profile for Sputtering Contact Stability
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Solution Overview
Problem
In magnetic recording disk fabrication, poor electrical contact between pins and the outer diameter edge of non-conductive glass substrates leads to chipping and arcing issues during the sputtering process, causing damage and contamination.
Innovation Solution
A disk design with a chamfered edge profile, where the edge surface extends between 40% and 80% of the disk thickness, and is perpendicular to the main surfaces, along with a deposition apparatus using pins for electrical contact and bias voltage application, to improve contact resistance and reduce arcing and chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pins are used to support the disk at outer diameter edge portions during deposition, then electrical contact is established for bias voltage application, but chipping and arcing occur due to poor electrical contact
Solution Approach 1:
The patent applies local quality by creating a chamfered edge profile at the specific location where pins contact the disk. The edge surface is formed at a 45-degree angle relative to the disk thickness direction, providing enhanced local electrical contact quality at the contact point while maintaining the overall disk structure. This localized geometric modification ensures stable electrical contact without affecting other portions of the disk.
Solution Approach 2:
The patent changes the geometric parameters of the disk edge by forming a chamfer with specific dimensions. The edge surface length is controlled to be between 10-50 micrometers, and the chamfer angle is maintained at 45 degrees. These parameter changes optimize the contact surface area and electrical conductivity at the pin-disk interface, preventing arcing and chipping during the deposition process.
2Reliability
If the edge surface length is too short, then the disk structure remains simple, but electrical contact stability is insufficient leading to arcing
Solution Approach 1:
The patent applies partial action by creating a limited-length chamfered edge surface rather than modifying the entire disk perimeter. The edge surface length is specifically controlled to be between 10-50 micrometers, which is sufficient to provide stable electrical contact at the pin interface without unnecessarily complicating the overall disk structure. This partial modification achieves the required electrical contact stability with minimal added complexity.
3Reliability
If the edge surface length is too long, then electrical contact is improved, but the disk becomes more susceptible to damage and the structure becomes overly complex
Solution Approach 1:
The patent optimizes the edge surface length parameter to a specific range of 10-50 micrometers. This parameter change provides sufficient contact area for stable electrical contact while maintaining disk edge strength. The 45-degree chamfer angle is also optimized to distribute mechanical stresses appropriately, preventing edge damage while ensuring reliable electrical contact during deposition processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chamfered edge profile and optimized contact conditions stabilize electrical contact, reducing contact resistance and preventing arcing and chipping, ensuring reliable deposition processes and minimizing disk damage.
Implementation Method 1
a sputtering process may be performed to sputter the magnetic recording layer on the disk substrate
Data Source
AI summary
A disk for a magnetic recording apparatus is described. The disk includes a first surface extending along a first plane, a second surface extending along a second plane parallel to the first plane, and a disk thickness between the first surface and the second surface, measured along a first direction substantially normal to the first surface. The disk further includes an edge surface disposed along a perimeter of the disk and between the first surface and the second surface, where the edge surface extends along a third plane substantially perpendicular to the first surface, a first chamfer disposed between the first surface and the edge surface, and a second chamfer disposed between the second surface and the edge surface. In an aspect, a length of the edge surface measured along the first direction may be between 40% and 80% of the disk thickness.