Chamfered Display Assembly for Thin Curved Housing Support
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Solution Overview
Problem
Designing a thin-profile consumer electronic device with a display assembly that balances structural support, thermal management, and aesthetic appeal is challenging due to conflicting design goals such as resistance to bending, heat dissipation, sealing, manufacturability, and aesthetics, particularly in enclosures with varying thickness profiles.
Innovation Solution
The use of a thin-profile display assembly with a protective cover layer, a display stack, and a flat support chassis that includes chamfered edges to accommodate curvature, along with a thermally conductive secondary frame for thermal dissipation and structural support, allowing the assembly to extend into regions of high curvature near the edges of the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the enclosure thickness is reduced to achieve a thin-profile design, then aesthetic appeal and compactness are improved, but structural rigidity and bending resistance deteriorate
Solution Approach 1:
The patent employs multiple layers with different mechanical and thermal properties (display cover glass, display components, support structure, enclosure) to achieve both thin-profile and high rigidity. The composite structure allows each layer to contribute specific properties, maintaining strength while reducing overall thickness.
Solution Approach 2:
The patent introduces curvature to the enclosure to eliminate blocky appearance and improve aesthetics. The curved design varies thickness from edges to center, achieving the desired aesthetic appeal while the support structure compensates for reduced rigidity in high-curvature regions.
2Strength
If thicker components are used to increase bending resistance, then structural strength is improved, but device thickness and weight increase
Solution Approach 1:
The patent divides the structural support function across multiple components: display cover glass, display components, support structure, and enclosure. This segmentation allows each component to be optimized for its specific function while collectively providing the required bending resistance without increasing overall device thickness.
Solution Approach 2:
The patent applies different material properties and thicknesses to different regions of the display assembly. The support structure and enclosure are designed with specific mechanical properties in high-curvature regions versus low-curvature regions, optimizing strength distribution to match local structural requirements.
3Temperature
If thermal mass and thermally conductive material are added to improve heat dissipation, then thermal performance is improved, but component stack thickness increases
Solution Approach 1:
The patent designs the support structure and enclosure to serve multiple functions simultaneously: providing structural support, enabling heat dissipation through thermally conductive materials, and maintaining the thin-profile design. This multi-functionality eliminates the need for separate thermal management layers.
Solution Approach 2:
The patent uses materials with different thermal and mechanical properties in the support structure and enclosure layers. The composite material selection allows optimization of both structural integrity and thermal performance within the constrained thickness of the component stack.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the device's structural integrity, thermal management, and aesthetic appeal while maintaining a thin profile, reducing the risk of component damage and improving usability and durability.
Implementation Method 1
a thermally conductive secondary frame for thermal management and structural support
Data Source
AI summary
A display assembly includes at least a protective cover layer, a display stack that includes a plurality of display components arranged in a plurality of interconnected layers, the display stack providing an imaging service, and a flat support chassis arranged to provide support for the display stack. In the described embodiment, the display stack is positioned between the protective cover layer and the flat support chassis. The display assembly can be disposed within a housing with sides sloping inwards where a portion the display assembly is proximate to the inward sloping sides. To allow the display assembly to fit closer to the edges of the housing, material can be removed from the flat support chassis. For example, edges of the flat support chassis can be chamfered.