Chamfered Drying Device for Semiconductor Substrate Particle Removal
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Solution Overview
Problem
Existing devices fail to effectively remove residual liquid and particles from the edges of disc-shaped semiconductor substrates during the drying process, leading to reduced quality due to unwanted particles on the substrate.
Innovation Solution
A device with an elongated body featuring a chamfered hole forming a conical recess and a drainage channel, optimized with a specific chamfer angle and depth, designed to accommodate disc-shaped substrates, which facilitates efficient liquid drainage and reduces particle residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional drying devices are used, then the substrate can be dried, but residual liquid and particles remain on the substrate edges
Solution Approach 1:
The device divides the drying function into separate components: the conical recess for initial liquid drainage and the channel system for continued capillary wicking. This segmentation allows each component to optimize its specific function, with the recess capturing edge residues and the channels removing them, thereby reducing particles without compromising overall drying capability
Solution Approach 2:
The patent introduces an intermediary structure (the conical recess with channels) between the substrate edge and the external environment. This intermediary captures residual liquid through the conical geometry and transports it away via capillary action in the channels, preventing direct contact between residual liquid and the substrate edge, thus eliminating the source of particles
2Object-generated harmful factors
If the chamfer depth is increased to improve liquid drainage, then particle removal improves, but the device complexity increases
Solution Approach 1:
The patent specifies precise parameter ranges (chamfer angle: 10°-30°, chamfer depth: 6-12 mm) to optimize the balance between liquid drainage effectiveness and device simplicity. These parameter constraints provide clear manufacturing guidelines while ensuring the conical recess is sufficiently deep to capture residues but not excessively complex to manufacture
Solution Approach 2:
The conical recess extends partially through the substrate thickness (6-12 mm depth), providing sufficient drainage capability without requiring complete penetration. This partial action achieves effective particle removal while maintaining substrate structural integrity and simplifying manufacturing compared to full-through designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device significantly reduces the number of particles on dried substrates, enhancing the quality of semiconductor wafers by ensuring effective liquid removal and minimizing edge residues.
Implementation Method 1
The physical effect utilized thereby are described in CN1045539 A
Data Source
AI summary
A device is for drying disc-shaped substrates. The device has an elongated body having a top surface, a bottom surface, and a circumferential surface. The elongated body has a hole in the top surface forming a channel, which extends to a lower drainage part of the elongated body, and is chamfered having a chamfer depth and a chamfer angle forming an edge between the chamfer and the top surface and forming a conical recess suitable for resting a disc shaped substrate. The chamfer angle is more than 10° and less than 30°. The chamfer depth is more than 6 mm and less than 12 mm.