Chamfered Temporary Fixation Substrate for Peeling and Chipping Control
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Solution Overview
Problem
Conventional temporary fixation substrates for semiconductor packages face issues with peeling failure and chipping during the fan-out wafer level packaging process, leading to reduced yield.
Innovation Solution
A temporary fixation substrate with a chamfered region on its circumference, featuring an arithmetic average roughness of 0.1 μm to 10 μm, is used to suppress peeling and chipping by providing an anchoring effect and reducing perpendicular corners, which are prone to chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional temporary fixation substrate with a smooth circumference is used, then the manufacturing process is simple, but peeling failure occurs at the circumference reducing yield
Solution Approach 1:
The invention applies a chamfered region with specific roughness (0.1 μm to 10 μm) only at the circumference of the temporary fixation substrate, while the central region maintains its original smooth surface. This local modification provides enhanced adhesion at the critical peeling-prone circumference without complicating the overall substrate structure or manufacturing process.
2Reliability
If the arithmetic average roughness of the chamfered region is increased, then peeling suppression is improved, but chipping at the lateral end may occur
Solution Approach 1:
The invention optimizes the arithmetic average roughness of the chamfered region to a specific range (0.1 μm to 10 μm). This parameter control ensures sufficient surface irregularities to prevent peeling while avoiding excessive roughness that would cause stress concentration and chipping at the lateral end of the substrate.
3Strength
If a chamfered region with high roughness is formed, then adhesion is enhanced, but the surface finish of the substrate deteriorates
Solution Approach 1:
The chamfered region with enhanced roughness (0.1 μm to 10 μm) is confined to the circumferential area, while the central region maintains its original smooth surface finish. This localized approach preserves the overall manufacturing precision of the substrate while providing sufficient adhesion strength at the critical circumference where peeling occurs.
Data Source
AI summary
A temporary fixation substrate having one main surface to which a plurality of electronic components adhere and are temporarily fixed by a resin mold has a chamfered region at an end over an entire circumference of each of the one main surface and the other main surface, and an arithmetic average roughness of the chamfered region at least on a side of the one main surface is 0.1 μm to 10 μm and is greater than an arithmetic average roughness of the one main surface.