Chamfered Glass Sheet for Semiconductor Substrate Alignment
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Solution Overview
Problem
The challenge is to develop a glass sheet that facilitates position alignment with a substrate during semiconductor package manufacturing while minimizing breakage and contamination, ensuring high-density mounting and accurate wiring.
Innovation Solution
A glass sheet with a position alignment portion featuring a chamfered edge region where the surface and end surface intersect, allowing for precise alignment and reduced stress concentration, thereby minimizing breakage and contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a glass sheet with a perfectly circular wafer shape is used to support the substrate, then the substrate can be supported strongly and accurately, but position alignment of the glass sheet and substrate becomes difficult
Solution Approach 1:
The patent introduces a position alignment portion with an asymmetric shape (flat surface or notch) on the otherwise circular glass sheet. This asymmetric feature breaks the rotational symmetry, enabling unique position alignment between the glass sheet and substrate while preserving the circular shape for support strength.
2Manufacturing precision
If the glass sheet has a sharp edge to facilitate alignment, then position alignment accuracy improves, but the glass sheet becomes more liable to breakage
Solution Approach 1:
The patent applies different surface qualities to different regions: the position alignment portion has a chamfered edge with a specific surface finish for accurate alignment, while the contour portion maintains a smooth edge for breakage resistance. This local differentiation resolves the contradiction between alignment accuracy and breakage prevention.
3Ease of manufacture
If heat treatment is applied to the substrate to form wiring and solder bumps, then the substrate can be processed, but the sealing material may deform and the substrate may change dimension
Solution Approach 1:
The patent selects glass as the supporting sheet material specifically for its low thermal expansion coefficient and high thermal stability. By changing the material parameter (from typical plastics to glass), the substrate can withstand heat treatment for wiring formation without significant dimensional change or sealing material deformation.
Data Source
AI summary
A technical object of the present invention is to devise a glass sheet that facilitates position alignment with a substrate to be processed and is less liable to be broken during conveyance, or processing treatment of the substrate to be processed, to thereby contribute to an increase in density of a semiconductor package. In order to achieve the technical object, the glass sheet of the present invention includes, in a contour thereof: a contour portion; and a position alignment portion, in which all or part of an end edge region of the position alignment portion where a surface thereof and an end surface thereof intersect is chamfered.