Chamfered Magnetic Sensor Substrate for Thin Accurate Angle Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing magnetic sensor devices face challenges in achieving both high measurement accuracy and further reduction in thickness, particularly in angle sensor devices used for detecting orientation or rotation angles, while densely packing sensor elements in a limited region.
Innovation Solution
The design incorporates a sensor substrate with chamfered corners and a specific ratio of the shortest distance to the sensor element circuitry, allowing for reduced stress concentration and improved mechanical strength, enabling further thickness reduction without compromising measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the sensor substrate has a rectangular shape with sharp corners, then the manufacturing process is simple, but stress concentration occurs at the corners causing mechanical weakness and limiting thickness reduction
Solution Approach 1:
The patent applies curvature by chamfering the four corners of the sensor substrate, transforming the sharp rectangular corners into rounded or angled surfaces. This curvature modification eliminates stress concentration points while maintaining a relatively simple overall rectangular shape, thus improving mechanical strength without significantly increasing device complexity.
Solution Approach 2:
The patent applies local quality by making only the corner regions different from the main body. The four corners are chamfered while the rest of the substrate maintains its original rectangular shape and properties. This localized modification addresses stress concentration at corners without affecting the overall structural integrity or increasing complexity of the entire substrate.
2Measurement precision
If the sensor elements are densely packed to improve measurement accuracy, then the measurement precision improves, but the available area for circuitry is reduced
Solution Approach 1:
The patent utilizes the vertical dimension by positioning the sensor element circuitry on the surface of the sensor substrate rather than occupying planar area. The sensor elements are arranged in a matrix pattern across the substrate surface, effectively using the two-dimensional area for high-density sensor packing while maintaining adequate space for circuitry through optimized layout.
Solution Approach 2:
The patent employs asymmetric layout design where the sensor element circuitry is positioned in specific regions of the substrate. By strategically placing circuitry away from the chamfered corners and utilizing the full substrate area efficiently, the design achieves dense sensor packing while preserving necessary circuit space.
3Length of moving object
If the substrate thickness is reduced to achieve miniaturization, then the device size decreases, but mechanical strength and stress resistance deteriorate
Solution Approach 1:
The patent applies curvature through corner chamfering that specifically addresses stress concentration points. This localized geometric modification provides stress resistance enhancement without requiring increased substrate thickness, allowing the substrate to maintain thin dimensions while improving mechanical strength.
Solution Approach 2:
The patent employs composite material structures combining the sensor substrate with support structures and encapsulation layers. This composite approach provides mechanical strength and stress resistance to thin substrates by distributing mechanical loads across multiple material layers rather than relying on substrate thickness alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chamfered corners mitigate stress concentration, enhancing mechanical strength and reducing distortion of the sensor element circuitry, thus enabling further reduction in thickness while maintaining high measurement accuracy.
Implementation Method 1
The chamfered corners mitigate stress concentration, enhancing mechanical strength and reducing distortion of the sensor element circuitry
Implementation Method 2
A magnetic sensor device adapted to detect a component, in a predetermined direction, of an external magnetic field has been used in various applications. A magnetic sensor to be included in the magnetic sensor device may have a magnetic detection element provided on a substrate. Examples of the magnetic detection element include a magnetoresistive effect element.
Data Source
AI summary
A magnetic sensor device includes a sensor substrate and a sensor element circuitry. The sensor substrate has a surface. The sensor element circuitry is provided on the surface of the sensor substrate and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, the sensor substrate has a perimeter that is substantially octagonal. The perimeter includes two short sides opposed to each other, two long sides opposed to each other, and four corners. The four corners are each chamfered entirely or partially in a thickness direction that is substantially orthogonal to the surface. A ratio of a length of each of the four corners along each of the two long sides of the sensor substrate to a length of each of the two long sides of the sensor substrate is less than or equal to 0.39.