Chamfered Side Wiring in Tiled Displays for Lower Resistivity
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Solution Overview
Problem
Existing display devices face challenges in reducing the resistivity of side wirings, which are crucial for achieving bezel-less designs and improving display area efficiency.
Innovation Solution
The display device incorporates a substrate with chamfered surfaces and varying packing densities and thicknesses of metal particles in the side wiring, along with a laser irradiation process to enhance connectivity and reduce resistivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the side wiring is formed with uniform metal particle packing density throughout, then the manufacturing process is simple, but the resistivity cannot be sufficiently reduced in critical areas
Solution Approach 1:
The patent applies local quality by varying the packing density of metal particles in different regions of the side wiring. Specifically, the first region (near the display area) has a higher packing density than the second region, allowing critical areas with higher current density to have lower resistivity while maintaining manufacturing feasibility through region-specific optimization.
Solution Approach 2:
The patent changes the physical parameter of metal particle packing density across different regions of the side wiring. By adjusting the packing density from uniform to non-uniform distribution, the electrical conductivity is improved in critical areas without requiring a complete redesign of the manufacturing process.
2Reliability
If laser irradiation is applied to reduce resistivity of side wiring, then connectivity is improved, but damage to the side wiring may occur
Solution Approach 1:
The patent applies local quality by selectively irradiating only the first region of the side wiring with laser, rather than the entire wiring. This targeted approach improves connectivity in the critical high-current-density area while avoiding unnecessary thermal exposure and potential damage to other regions of the side wiring.
Solution Approach 2:
The patent uses partial action by applying laser irradiation only to the portion of the side wiring that requires improved connectivity (the first region near the display area), rather than treating the entire wiring uniformly. This reduces the total thermal exposure and minimizes the risk of damage while still achieving the desired connectivity improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively lowers resistivity and contact resistance, enabling a bezel-less display device with improved connectivity and reduced damage to side wirings.
Implementation Method 1
irradiating a laser to a first portion of a first side wiring provided on the second surface of the substrate among the plurality of side wirings
Implementation Method 2
irradiating a laser to a first portion of a first side wiring provided on the second surface of the substrate among the plurality of side wirings
Data Source
AI summary
A display device includes a substrate including a first surface, a second surface opposite the first surface, a first chamfered surface extending from a side of the first surface, a second chamfered surface extending from a side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface, a plurality of subpixels on the first surface, a side wiring on the first surface, the first chamfered surface, the first side surface, the second chamfered surface, and the second surface of the substrate, and a circuit board on the second surface. The side wiring comprises a first portion on the first surface and a second portion on the first side surface, and includes metal particles where a packing density of the metal particles in the first portion is higher than a packing density of the metal particles in the second portion.