Chamfered Semiconductor Substrates for Non-Destructive Resistivity Measurement

Solution Overview

Problem

The existing methods for electrical resistivity measurements of semiconductor substrates are destructive, rendering the substrates unsuitable for further use and increasing manufacturing costs due to the need for beveling, which is essential for accurate harmonic minimization in RF devices.

Innovation Solution

A semiconductor substrate design featuring a chamfered surface within an edge exclusion region allows for non-destructive electrical resistivity measurements, enabling the substrate to remain usable for device fabrication after testing, by forming an acute angle with the front surface and utilizing a grinding process for material removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a bevel is formed through the semiconductor substrate sample for electrical resistivity measurement, then measurement accuracy is improved, but the substrate is rendered unsuitable for further use and manufacturing costs increase

Engineering Contradiction:

Improveelectrical resistivity measurement accuracyVSAvoidsubstrate usability

Core Design Contradiction:

Measurement precisionVSLoss of substance

Solution Approach 1:

The substrate is divided into distinct regions: a front region for device fabrication and an edge exclusion region for measurements. The chamfered surface is specifically formed in the edge exclusion region, separating the measurement function from the fabrication function, allowing each to be optimized independently without interfering with the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The measurement function is extracted and relocated to the edge exclusion region with the chamfered surface, removing it from the front region where device fabrication occurs. This extraction allows the front region to remain intact and usable for fabrication while the edge region serves the measurement purpose.

Inventive Principle:

Principle #2Taking out (Extraction)

2Measurement precision

If a bevel is formed through the semiconductor substrate sample for electrical resistivity measurement, then measurement accuracy is improved, but manufacturing costs increase due to substrate waste

Engineering Contradiction:

Improveelectrical resistivity measurement accuracyVSAvoidmanufacturing cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The substrate is divided into distinct regions: a front region for device fabrication and an edge exclusion region for measurements. The chamfered surface is specifically formed in the edge exclusion region, separating the measurement function from the fabrication function, allowing each to be optimized independently without interfering with the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The edge exclusion region is designed to be discarded or used exclusively for measurements, while the front region is recovered and preserved for device fabrication. This selective discarding of only the peripheral region minimizes waste while maintaining substrate usability for the primary fabrication purpose.

Inventive Principle:

Principle #34Discarding and recovering

3Ease of operation

If a chamfered surface is formed in the edge exclusion region, then non-destructive measurement is enabled, but additional processing steps are required

Engineering Contradiction:

Improvesubstrate reusabilityVSAvoidsubstrate structure

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The substrate is divided into distinct regions: a front region for device fabrication and an edge exclusion region for measurements. The chamfered surface is specifically formed in the edge exclusion region, separating the measurement function from the fabrication function, allowing each to be optimized independently without interfering with the other.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables non-destructive electrical resistivity profiling, reducing waste and manufacturing costs while ensuring the substrate's suitability for further processing, thereby verifying the substrate's quality before semiconductor device fabrication.

Implementation Method 1

forming an acute angle with the front surface and utilizing a grinding process for material removal

Methodology Applied

Scientific EffectGrinding: Abrasion

Data Source

PatentUS11841296B2Semiconductor substrates for electrical resistivity measurements

Publication Date: 2023.12.12 GLOBALFOUNDRIES US INC

AI summary

A substrate is provided. The substrate includes a front region having a front surface, a back region having a back surface, an edge exclusion region, and a chamfered surface. The back surface is laterally opposite the front surface. The edge exclusion region is surrounding the front region. The chamfered surface is at least partially arranged in the edge exclusion region.